| PART |
Description |
Maker |
| FPT-28P-M17 |
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC 小外形L -引线封装28引脚塑料
|
Fujitsu Limited
Fujitsu, Ltd.
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| AP2607AGY-HF AP2607AGY-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP9451GG |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2304AGN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2328GN-HF |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
|
| AP2318GEN-HF AP2318GEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2329GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
| AP2310GN |
Simple Drive Requirement Small Package Outline Surface Mount Device
|
TY Semiconductor Co., Ltd
|
| MT2LDT432HG-6X MT2LDT432HG-5X MT4LDT832HG-5XS MT2L |
SMALL-OUTLINE DRAM MODULE 小外形DRAM模块
Silver Mica Capacitor; Capacitance:1200pF; Capacitance Tolerance: 5%; Series:CDV30; Voltage Rating:1500VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:11.1mm; Leaded Process Compatible:No RoHS Compliant: No 小外形DRAM模块
|
Micron Technology, Inc.
|
