| PART |
Description |
Maker |
| AN3232 |
Mounting recommendations
|
STMicroelectronics
|
| AN4208 |
package description and recommendations for use
|
STMicroelectronics
|
| AN1235 |
package description and recommendations for use
|
STMicroelectronics
|
| AN11689 |
Recommendations for PCB assembly of DSN1006
|
NXP Semiconductors
|
| AN4002 |
Recommendations For Long -Term Transistor Storage
|
M/A-COM Technology Solutions, Inc.
|
| TB502-3X-520-XX |
Test Board for chip evaluation and Layout recommendations
|
PLL[PhaseLink Corporation]
|
| AN-0971 |
Recommendations for Control of Radiated Emissions with isoPower Devices
|
Analog Devices
|
| AN1580 |
MOUNTING AND SOLDERING RECOMMENDATIONS FOR THE MOTOROLA POWER FLAT PACK PACKAGE
|
Motorola, Inc
|
| TB520-XX TB502 TB502-3X |
Test Board for chip evaluation and Layout recommendations
|
PLL[PhaseLink Corporation]
|
| AN2027 |
Mounting recommendations for ceramic DMOS packages
|
STMicroelectronics
|
