| PART |
Description |
Maker |
| FPT-28P-M17 |
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC 小外形L -引线封装28引脚塑料
|
Fujitsu Limited
Fujitsu, Ltd.
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| SO-8 |
8-LEAD SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| POWERSOP |
Power Small Outline Package,PowerSOP
|
Amkor Technology
|
| AP2318GEN-HF AP2318GEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2327GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2321GN-HF AP2321GN-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2306AGEN-HF AP2306AGEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AK18D300-QSOP AK06D300-QSOP12 AK14D300-QSOP AK20D3 |
Quarter Size Small Outline Package QSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| AP2318AGEN-HF AP2318AGEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package, Surface Mount Device
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| SOT765-1 |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
