| PART |
Description |
Maker |
| WBSC0504-22NF-50V |
Wire Bonding Silicon Vertical Capacitor
|
Micross Components
|
| STV0498 |
DOCSIS 2.0 cable modem chip with channel bonding
|
STMicroelectronics
|
| S8650 |
Si PIN photodiode Flat surface ideal for bonding to scintillator
|
Hamamatsu Corporation
|
| TAB-35006 |
Tape Carrier Package/Tape Automated Bonding (TCP/TAB)
|
Yamaichi Electronics
|
| CYP15G0401DXB-BGXI |
Quad HOTLink II (TM) Transceiver; Features: Channel Bonding, 8B/10B, Redundancy, BIST, JTAG; Frequency Range: 0.2 to 1.5 Gbps; Standard: Ethernet, Fibre Channel, ESCON, DVB-ASI;
|
CYPRESS SEMICONDUCTOR CORP
|
| PG320240-E |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| 38D9UXE 38D9UXM |
Schematic Diagram
|
ETC
|
| STV2160 |
Complete PCB Diagram
|
ST Microelectronics
|
| STK-403-070 |
AMP Schematic Diagram
|
ETC
|
| MC9RS08KA4 MC9RS08KA8 |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
| MC9RS08KA4CPG MC9RS08KA4CPJ MC9RS08KA4CTG MC9RS08K |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
| MC9RS08LE4WL MC9RS08LE409 |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
