PART |
Description |
Maker |
70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0022284108 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
22-28-4096 0022284096 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 9 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240) 2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, 9 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240) 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 9 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240)
|
Molex Electronics Ltd.
|
0901200960 90120-0960 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 40 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
90147-1104 0901471104 |
2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 4 Circuits 2.54mm (.100) Pitch C-Grid垄莽 PC Board Connector, Single Row, Vertical, 4 Circuits
|
Molex Electronics Ltd.
|
90147-1110 0901471110 |
2.54mm (.100) Pitch C-Grid庐 PC Board Connector, Single Row, Vertical, 10 Circuits 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 10 Circuits
|
Molex Electronics Ltd.
|
87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
0015910360 015-91-0360 71308-0136N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 36 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
22-28-0052 |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Friction Lock, 5 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
22-28-0061 |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Friction Lock, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
22-28-0031 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
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