| PART |
Description |
Maker |
| FO-EX-LCAD2 |
FRONT HOUSING SYNTHETIC RESIN
|
Japan Aviation Electronics Industry, Ltd.
|
| FO-EX-SCAD1-001 FO-EX-SCAD1-002 FO-EX-SCAD1-003 FO |
FRONT HOUSING SYNTHETIC RESIN
|
Japan Aviation Electronics Industry, Ltd.
JAE Electronics, Inc.
|
| 2203154 |
Handheld housing, C-Mini-Plus, light gray, consisting of two half shells, two front plates with screws, front 1.1 mm recessed, closed
|
PHOENIX CONTACT
|
| 1431429 |
HOUSING WITH CRIMP CONTACTS FRONT MOUNTING
|
PHOENIX CONTACT
|
| AC08FSMA AC08DSMA |
8A resin insulating TRIAC
(AC08DSMA / AC08FSMA) 8A RESIN INSULATION TYPE TRIAC
8A RESIN INSULATION TYPE TRIAC 8A条树脂绝缘型可控
ECONOLINE: RB & RA - Dual Output from a Single Input Rail- Power Sharing on Output- Industry Standard Pinout- 1kVDC & 2kVDC Isolation- Custom Solutions Available- UL94V-0 Package Material- Efficiency to 85% 8A条树脂绝缘型可控
|
NEC[NEC]
NEC Corp.
NEC, Corp.
|
| 50-57-9212 |
SL?Crimp Housing, Single Row, Version C, Front Ribs, 12 Circuits
|
Molex Electronics Ltd.
|
| STI1000 |
Synthetic Test Systems
|
Aeroflex Circuit Technology
|
| 50-57-9212 |
2.54mm (.100") Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 12 Circuits
2.54mm (.100) Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 12 Circuits
|
Molex Electronics Ltd.
|
| 50-57-9204 70066-0073 |
2.54mm (.100) Pitch SL?/a> Crimp Housing, Single Row, Version C, Front Ribs, 4 Circuits
2.54mm (.100) Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 4 Circuits
|
Molex Electronics Ltd.
|
| T7024-TRS T7024 T7024-PGP T7024-PGQ T7024-TRQ |
The T7024 is a monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT.
BluetoothISM 2.4-GHz Front- End IC
Bluetooth?ISM 2.4-GHz Front- End IC
Bluetooth⑩/ISM 2.4-GHz Front- End IC
Bluetooth/ISM 2.4-GHz Front- End IC
|
Atmel Corp.
ATMEL[ATMEL Corporation]
|
