| PART |
Description |
Maker |
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| SIDC02D60SIC2SAWN SIDC02D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 6A die sawn
Diodes - HV Chips - 600V, 6A die unsawn
|
Infineon
|
| 04A1 04A-K01 |
Position Locator On CRT Screens
|
Grayhill, Inc
|
| 0559320610 55932-0610 |
2.00mm (.079) Pitch MicroClasp Wire-to-Board Header, Single Row, Vertical, 6Circuits, with PCB Locator
2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Header, Single Row, Vertical, 6Circuits, with PCB Locator
2.00mm (.079") Pitch MicroClasp垄芒 Wire-to-Board Header, Single Row, Vertical, 6Circuits, with PCB Locator
MOLEX Connector
|
Molex Electronics Ltd.
|
| OVF-1 |
Pen-size Visual Fault Locator
|
JDS Uniphase Corporation
|
| 412-18930 |
Matrizen-Satz mit Locator für
|
Tyco Electronics
|
| MURC520 |
MURC520 Ultrafast Silicon Die
MURC520 Ultrafast Silicon Die
|
Sensitron
|
| SIDC03D30SIC2SAWN SIDC03D30SIC2UNSAWN |
Diodes - HV Chips - 300V, 10A die sawn
Diodes - HV Chips - 300V, 10A die unsawn
|
Infineon
|
| X76F128HG-2.7 X76F128HE-2.7 X76F128HEG-2.7 |
16K X 8 FLASH 2.7V PROM, UUC ROHS COMPLIANT, DIE
16K X 8 FLASH 2.7V PROM, UUC DIE
|
IC MICROSYSTEMS Sdn. Bhd.
|
| 87833-2621 |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Shrouded, Lead-free, 26 Circuits, 0.76μm (30μ) Gold (Au) Plating, without PCB Locator, with Locking Windows
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Shrouded, Lead-free, 26 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Plating, without PCB Locator, with Locking Wind
|
Molex Electronics Ltd.
|
| IXFN340N07 IXFN340N0704 |
HiPerFET?/a> Power MOSFETs Single Die MOSFET
HiPerFET⑩ Power MOSFETs Single Die MOSFET
HiPerFET Power MOSFETs Single Die MOSFET
|
IXYS Corporation
|
