| PART |
Description |
Maker |
| KI5935DC |
TrenchFET Power MOSFETS Low rDS(on) Dual and Excellent Power Handling In A Compact Footprint
|
TY Semiconductor Co., Ltd
|
| SOD80C FOOTPRINT-SOD80C |
PC board footprint
|
PHILIPS[Philips Semiconductors]
|
| DD50-PH-C3A |
FOOTPRINT R-A D-SUB PLUG
|
Adam Technologies, Inc.
|
| LQFP44 |
PC board footprint
|
Philips
|
| MDT2012-CLR |
Miniature size: 2012 footprint
|
TOKO, Inc
|
| BXB50 BXB50-24S12FLTJ BXB50-24S3V3FLTJ BXB50-24S15 |
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
|
Emerson Network Power
|
| KP3812W00A16 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| BGU7003 BGU7004 BGU7005 BGU7007 BGU7008 BGU8007 |
The best reception of GNSS signals with the smallest footprint
|
NXP Semiconductors
|
| 93405-0808 93405-0810 93405-0816 93405-0818 93405- |
REVERSE FOOTPRINT PICOFLEX SMT HEADER
|
Molex Electronics Ltd.
|
| 0022436140 22-43-6140 A-42249-14A |
2.50mm (.098) Pitch SPOX?/a> Header, Shrouded, Staggered Footprint, 14 Circuits, White
2.50mm (.098) Pitch SPOX Header, Shrouded, Staggered Footprint, 14 Circuits, White
MOLEX Connector
|
Molex Electronics Ltd.
|
| ECS-200-20-23BEL-TR ECS-200-S-23BEL-TR |
The ECX-64 is a miniature SMD Crystal with a 6 x 3.5 mm 4 pad footprint
|
ECS, Inc.
|
| MPB125-4350 MPB125 MPB125-2005 MPB125-2012 MPB125- |
High Power Density in Industry Standard 3 x 5 Footprint
|
POWER-ONE[Power-One]
|
