| PART |
Description |
Maker |
| HC49USM8-BI0F18-20.000 HC49USM8-BI1318-20.000 HC49 |
4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
|
ILSI America LLC
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| DFN-2-0402 |
package outline & pad layout
|
Protek Devices
|
| J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| AXX5032-2 |
Quartz Crystal Unit in SMD package 5.0x3.2 mm Resin sealed 2 pad
|
Advanced XTAL Products
|
| ILCX13-GHD318-20.000 ILCX13-GHDF18-20.000 ILCX13-B |
4 Pad Ceramic Package, 2.5 mm x 3.2 mm
4 Pad Ceramic Package, 2.5 mm x 3.2 mm
|
ILSI America LLC
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SB35-45M SB35-40M |
Dual Schottky Barrier Diode In TO254 Metal Package For HI-REL Application(Common Cathode)(双肖特基势垒二极HI-REL应用,TO254金属封装,共阴极连)
DUAL SCHOTTKY BARRIER DIODE IN TO254 METAL PACKAGE FOR HI-REL APPLICATIONS
|
TT electronics Semelab Limited
Semelab(Magnatec)
SEME-LAB[Seme LAB]
|
| BUP53 BUP52 BUP53.MODR1 |
60 A, 250 V, NPN, Si, POWER TRANSISTOR, TO-204AE HERMETIC SEALED, METAL, TO-3, 2 PIN
Bipolar NPN Device in a Hermetically sealed TO3 Metal Package.
|
TT electronics Semelab, Ltd.
SEME-LAB[Seme LAB]
|
| AD8195ACPZ |
1:1 HDMI/DVI Buffer with Equalization; Package: LFCSP (6x6mm w/4.1mm pad); No of Pins: 40; Temperature Range: Industrial SPECIALTY CONSUMER CIRCUIT, QCC40
|
Amphenol, Corp.
|
| CD6274CA CD6275 CD6302CA 1.5KCD6.8C CD6272CA CD628 |
Low Capacitance, 16 - Channel ±15 V/12 V iCMOS™ Multiplexer; Package: LFCSP (5x5x.85mm) w/2.7exposed pad; No of Pins: 32; Temperature Range: TBD 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
Low Capacitance, 16 - Channel ±15 V/12 V iCMOS™ Multiplexer; Package: TSSOP (4.4mm); No of Pins: 28; Temperature Range: TBD 1500 W, UNIDIRECTIONAL, SILICON, TVS DIODE
0.5 Ω CMOS 1.65 V TO 3.6 V 4-Channel Multiplexer; Package: MSOP; No of Pins: 10; Temperature Range: Automotive 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
CELLULAR DIE PACKAGE 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
480 MHz, Single Supply, Triple 2:1, Buffered (G= 2) Multiplexer; Package: EVALUATION BOARDS; No of Pins: -; Temperature Range: Industrial 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
16-Channel Multiplexer (Superior DG506A Replacement); Package: PLCC; No of Pins: 28; Temperature Range: Commercial 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
5 Ω Max Ron, 4 - /8 - Channel ±15 V /12 V /± 5 V Multiplexers; Package: LFCSP (4x4mm, 2.50mm exposed pad); No of Pins: 16; Temperature Range: Industrial 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
CMOS Low Voltage, 3 O 4-Channel Multiplexer; Package: TSSOP; No of Pins: 16; Temperature Range: Industrial 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
0.28 O CMOS 1.65 V to 3.6 V Single SPST Switches in SC70 Open for a Logic 1 Input; Package: SC70; No of Pins: 6; Temperature Range: Industrial 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
Low Capacitance, 8-Channel, ±15 V/ 12 V iCMOS® Multiplexer; Package: TSSOP; No of Pins: 16; Temperature Range: Commercial 1500 W, UNIDIRECTIONAL, SILICON, TVS DIODE
Low Capacitance, 8-Channel, ±15 V/ 12 V iCMOS® Multiplexer; Package: LFCSP (4x4x.85mm, 2.10mm exposed pad); No of Pins: 16; Temperature Range: TBD 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
Low Capacitance, 4-Channel, ±15 V/ 12 V iCMOS™ Multiplexer; Package: TSSOP; No of Pins: 16; Temperature Range: TBD 1500 W, BIDIRECTIONAL, SILICON, TVS DIODE
4 Channel Buffered, 250 MHz, 10 ns Switching Multiplexer w/Amplifier; Package: SOIC; No of Pins: 14; Temperature Range: Industrial
|
Microsemi, Corp.
MICROSEMI CORP-SCOTTSDALE
|
|
