| PART |
Description |
Maker |
| BO6464A |
FSTN Transflective LCD, COG package Built-in driver PCF8548, serial I2C data bus
|
BOLYMIN[Bolymin, Inc]
|
| LCM-S01602DSF-B-Y |
5.56mm CHARACTER HEIGHT
|
LUMEX INC.
|
| WH0802A-YYH-CP |
LCD Character Display Modules Yl/Grn Transflective Yl/Grn LED Backlight
|
Microtips Technology, Inc.
|
| DMF-50202NY-LY |
128 x 64dots; 0.40 x 0.56mm; 0.3-7.0V 1.0mA LCD module
|
Optrex Corporation
|
| LCM-S01601DSF |
6.56mm CHARACTER HEIGHT , 5x8 DOT MATRIX, 16x1 LCD MODULE
|
LUMEX INC.
|
| 0440671001 44067-1001 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0440671003 44067-1003 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0440672401 SD-44067-001 44067-2401 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-1601 0440671601 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
| 44067-0802 0440670802 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
|
Molex Electronics Ltd.
|
| 44067-1802 0440671802 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
|
Molex Electronics Ltd.
|
|
