| PART |
Description |
Maker |
| MB8502E064AA-60L B8502E064AA-70 |
144-PIN SO DIMM 2 M×64 BITS
Hyper Page Mode Dram Module(CMOS 2 M×64 位超级页面存取模式动态RAM模块)
144-PIN SO DIMM 2 M?64 BITS Hyper Page Mode Dram Module(CMOS 2 M?64 浣??绾ч〉?㈠???ā寮????AM妯″?)
|
Fujitsu Limited
|
| HMF2M32B4VN-120 HMF2M32B4VN-70 HMF2M32B4VN-90 |
FLASH-ROM MODULE 8MByte (2M x 32Bit), 144-Pin SODIMM, 3.3V
|
Hanbit Electronics Co.,Ltd
|
| VSC3144 |
6.5 Gbps 144 144 Asynchronous Crosspoint Switch
|
Vitesse Semiconductor Corporation.
|
| MB8502E064AA-60 |
144-PIN SO DIMM 2 M×64 BITS
Hyper Page Mode Dram Module(CMOS 2 M×64 位超级页面存取模式动态RAM模块)
|
Fujitsu Limited
|
| M3T-FLX-144NSD |
Converter for Connecting 160-core Flexible Board FLX160 to 144-pin 0.5mm-pitch LQFP
|
Renesas Electronics Corporation
|
| 73944-7016 0739447016 |
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
|
Molex Electronics Ltd.
|
| 73944-7017 0739447017 |
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits
|
Molex Electronics Ltd.
|
| AK632256AWG-12 |
262,144 x 32 Bit CMOS/BiCMOS Static Random Access Memory 262,144 × 32位的CMOS / BiCMOS工艺静态随机存取存储器
|
Accutek Microcircuit, Corp.
|
| M3H71FAD-R M3H15TDD M3H52TCD-R MH75FBD MH75FAG MH7 |
8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
16-bit, 75 MIPS, 2.5v, 2 serial ports, host port, 80 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 20KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
16-Bit, 75 MIPS, 2.5V, 2 Serial Ports, Host Port, 40 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: 576 ball SBGA; No of Pins: 576; Temperature Range: Ind
300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 625 ball BGA; No of Pins: 625; Temperature Range: Ind
500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: BGA THERM ENH W/ HEATSINK; No of Pins: 576; Temperature Range: Ind
300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 484 ball BGA; No of Pins: 484; Temperature Range: Ind
8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
|
MTRONPTI
|
| 0739441009 |
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
|
Molex Electronics Ltd.
|
|
