| PART |
Description |
Maker |
| C1005X7S2A103MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1608X7S2A104KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| 2450BL15K050 |
2.45 GHz Medium Performance Balun (Compatible with TDK)
|
Johanson Technology Inc.
|
| GLF2012T220K GLF251812T220M GLC2518T101K GLF2518T1 |
GLF,GLC Series
TDK’s New Winding Type Chip Inductor
|
TDK Electronics
|
| 55PC0233 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC0223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC7000 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC2224 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| TP0101K TP0101K-T1-E3 TP0101T |
TP0101K vs. TP0101T Specification Comparison
TP0101K vs. TP0101T Specification Comparison
P-Channel 20-V (D-S) MOSFET, Low-Threshold P通道20 - V（下局副局长）MOSFET的低阈
|
VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
| MPC8240RZUPND MPC8240RZUPNS |
MPC8240 Part Number Specification for the XPC8240RZUnnnx Series
Part Number Specification for the XPC8240RZUnnnx Series
|
Motorola
|
