| PART |
Description |
Maker |
| PST593DM PST592C PST592CM PST591JM PST591H PST591H |
30V FETKY - MOSFET and Schottky Diode in a SO-8 package; Similar to IRF7901D1 with Lead Free Packaging
30V Dual N-Channel HEXFET Power MOSFET in a TSSOP-8 package; A IRF7752 with Standard Packaging
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7301 with Lead Free Packaging
30V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7303 with Lead Free Packaging
200V Dual N-Channel Digital Audio HEXFET Power MOSFET in a TO-220 Full-Pak(Iso) package.; A IRFI4020H-117P with Standard Packaging 电压检测器
Voltage Detector 电压检测器
30V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF9956 with Standard Packaging 电压检测器
30V Dual N- and P- Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF9952 with Lead Free Packaging 电压检测器
|
NXP Semiconductors N.V.
Intersil, Corp.
|
| PSR54-9P PSA55-9R PSA55-7I PSR53-7R PSR53-9P PSR53 |
60V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A IRF054 with Standard Packaging
Analog IC
Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to the iP2003A in Tape and Reel packaging.
500V Single N-Channel Hi-Rel MOSFET in a TO-259AA package; A IRFI460 with Standard Packaging
400V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY340CM with Standard Packaging
Synchronous Buck Multiphase Optimized BGA Power Block.; Tape and Reel version of the iP2002
-100V Single P-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE9110 with Standard Packaging
Synchronous Buck Multiphase Optimized BGA Power Block.; A IP2002 with Standard Packaging
-100V Single P-Channel Hi-Rel MOSFET in a TO-205AF package; A JANTXV2N6845 with Standard Packaging 模拟IC
Dual Output Full Function 2 Phase Synchronous Buck Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; A IP1202 with Standard Packaging 模拟IC
|
TE Connectivity, Ltd.
|
| AM29DL323DB90WDIN AM29DL323DB120WDI AM29DL323DB120 |
500V Single N-Channel Hi-Rel MOSFET in a TO-204AA package; A IRF450 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A JANTX2N7228 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE430 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a 18-pin LCC package; A JANTX2N6802U with Standard Packaging
12V Single N-Channel Hi-Rel MOSFET in a SMD-0.5 package; A IRL7NJ3802 with Standard Packaging
60V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY044CM with Standard Packaging
100V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRFM140 with Standard Packaging
-20V Single P-Channel Hi-Rel MOSFET in a SMD-0.5 package; A IRL5NJ7404 with Standard Packaging
150V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRF5M3415 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a SMD-1 package; A JANTXV2N7222U with Standard Packaging
100V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A JANTXV2N7218 with Standard Packaging
200V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRFM260 with Standard Packaging
AME270461; A AME270461 with Standard Packaging x8/x16闪存EEPROM
AFC461; Qualified Part Number similar to AFC461 x8/x16闪存EEPROM
AME28461; A AME28461 with Standard Packaging x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
100V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A JANTXV2N6764 with Standard Packaging x8/x16闪存EEPROM
IR2113L6; A IR2113L6 with Standard Packaging x8/x16闪存EEPROM
-55V Single P-Channel Hi-Rel MOSFET in a TO-254AA package; A IRF5M4905 with Standard Packaging x8/x16闪存EEPROM
|
Spansion, Inc.
|
| 87797-0010 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging
|
Molex Electronics Ltd.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| AM29F400AB-150FEB AM29F400AT-150FE AM29F400AT-150S |
55V Single N-Channel HEXFET Power MOSFET in a D2Pak Package; A IRF3205ZS with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFB3307 with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF1010ZL with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF1010Z with Standard Packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF3707 with Standard Packaging
x8/x16 Flash EEPROM
75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to IRF1407 with Lead Free Packaging
100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRLU120N with Standard Packaging x8/x16闪存EEPROM
|
Advanced Micro Devices, Inc.
|
| AM29F400B-75FC AM29F400B-75SC AM29F400B-75EC AM29F |
60V Single N-Channel HEXFET Power MOSFET in a TO-247AC package; Similar to IRFP064V with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFZ24N with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU120N with Lead Free Packaging
60V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF1010EL with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3710ZS with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFZ46NL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to the IRF1010N with Lead-Free Packaging.
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709 with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7466 with Lead Free Packaging
100V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR3412 with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRL2505S with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3911 with Lead Free Packaging
40V Single N-Channel Automotive HEXFET Power MOSFET in a TO-220AB package; Similar to IRF4104 with Lead Free Packaging x8/x16闪存EEPROM
30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRLR3303 with Lead Free Packaging x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRLZ24N with Standard Packaging x8/x16闪存EEPROM
30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRLR7821 with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRF3707ZCL with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRL8113L with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7484 with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU3910 with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3910 with Lead Free Packaging
80V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRLR2908 with Lead Free Packaging
|
Rochester Electronics, LLC
Amphenol, Corp.
Advanced Micro Devices, Inc.
|
| 0879143016 87914-3016 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879145016 87914-5016 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| AM29F080-150EEB AM29F080-150SEB AM29F080-120FEB AM |
x8 Flash EEPROM
30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRL3303S with Lead Free Packaging
20V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRL3502S with Lead Free Packaging
75V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3808S with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to IRF3707Z with Lead Free Packaging
75V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRFS3307 with Standard Packaging
30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7809AV with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR3709ZCPBF with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFB59N10D with Standard Packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRL2703 with Standard Packaging x8闪存EEPROM
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRFL024N with Lead Free Packaging x8闪存EEPROM
100V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package; Similar to IRFI530N with Lead Free Packaging
|
Amphenol, Corp.
|
| 87914-0807 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging
|
Molex Electronics Ltd.
|
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