PART |
Description |
Maker |
KF2004-GM50 KF2004-GM50A |
Thermal Printheads > For BARCODE, SCALE > KF2002*-, 300*-GM Series Thick film thermal printhead (with thermal historical control) 厚膜热敏打印头(热历史与控制
|
ROHM[Rohm] Rohm CO.,LTD. Rohm Co., Ltd.
|
801-4331-A42 801-2-31-A40 |
KotronTM II Series 801 RF Capacitance Transmitter For Level/Flow/Volume
|
Magnetrol International, Inc.
|
801-4234-A0 801-2031-A40 |
Kotron? Model 801 RF Capacitance Transmitter for Level/Flow/Volume
|
Magnetrol International, Inc.
|
EM800-DCMT14 |
LambdaDriver? Tunable Dispersion Compensation Module
|
MRV Communications, Inc.
|
EG1126 |
Integrated Flow Function, Off-LIne Flow Model PWM controller
|
Jingjing Microelectroni...
|
17572 17572-G |
HTSNK. B X-FLOW. .9H LOW FLOW. THRU HOLE HTSNKB型X流0.9 低流量。通孔
|
Vicor, Corp. VICOR[Vicor Corporation]
|
CY7C1475V33-133BGXI CY7C1475V33-133BGI CY7C1475V33 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBLArchitecture 4M X 18 ZBT SRAM, 8.5 ns, PBGA165 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBLArchitecture 4M X 18 ZBT SRAM, 6.5 ns, PQFP100 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture(带NoBL结构B>72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM) 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL?/a> Architecture 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL垄芒 Architecture
|
Cypress Semiconductor, Corp. Cypress Semiconductor Corp.
|
SE2004-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
KF3004-GM50A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
1LWP2300 5TH21000 5TH23000 |
THERMAL Pads For SC, SV and SO relays Low thermal resistance Easy to use
|
celduc-relais
|
KD2003-DC70A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|