| PART |
Description |
Maker |
| CYM1841LPN-55C CYM1841LPN-35C CYM1841LPN-45C |
256K X 32 MULTI DEVICE SRAM MODULE, 55 ns, SMA64
256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, SMA64
|
Cypress Semiconductor, Corp.
|
| SYS32256ZK-12 SYS32256ZK-15 SYS32256ZK-17 SYS32256 |
256K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PZMA64 PLASTIC, ZIP-64
256K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZMA64 PLASTIC, ZIP-64
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZMA64 PLASTIC, ZIP-64
256K x 32 SRAM MODULE
|
MOSAIC
|
| CYM26KAH24AV33-10BGC CYM26KAH24AV33-12BGC CYM26KAH |
256K X 24 MULTI DEVICE SRAM MODULE, 10 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
256K X 24 MULTI DEVICE SRAM MODULE, 12 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Memory 内存
|
Cypress Semiconductor, Corp.
Electronic Theatre Controls, Inc.
|
| MF38M1-LCDAGBM MF38M1-L6DAGAM MF38M1-LSDAGAM MF88M |
8M X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA
8M X 8 FLASH 5V PROM CARD, 25 ns, XMA68
8M X 8 FLASH 5V PROM CARD, 70 ns, XMA68
20M X 8 FLASH 5V PROM CARD, 150 ns, XMA68
512K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA
256K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA
|
Ironwood Electronics
Numonyx Asia Pacific Pte, Ltd.
|
| WED2ZL361MSJ-BC WED2ZL361MSJ26BI WED2ZL361MSJ42BC |
NBL SSRAM MCP
1M X 36 MULTI DEVICE SRAM MODULE, 2.6 ns, PBGA119
1M X 36 MULTI DEVICE SRAM MODULE, 4.2 ns, PBGA119
|
WHITE ELECTRONIC DESIGNS CORP
|
| M68AW256ML70ZB6 M68AW256ML55ND1 M68AW256ML55ND1E M |
4 Mbit (256K x16) 3.0V Asynchronous SRAM 4兆位56K × 16.0V异步SRAM
256K X 16 STANDARD SRAM, 55 ns, PDSO44
256K X 16 STANDARD SRAM, 70 ns, PBGA48
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
意法半导
STMicroelectronics N.V.
|
| WS128K32V-35HS WS128K32V-35HC |
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, HIP66
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66
|
WHITE ELECTRONIC DESIGNS CORP
|
| AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30
64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22
256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22
1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22
128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
| SYS32512ZK-010 SYS32512ZK-012 SYS32512ZK-015 SYS32 |
512 K x 32 Static RAM
512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZMA72 PLASTIC, ZIP-72
512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PZMA72 PLASTIC, ZIP-72
512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PSMA72 PLASTIC, SIMM-72
512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PSMA72 PLASTIC, SIMM-72
512 K x 32 Static RAM 512亩32静态RAM
|
Amphenol, Corp.
MOSAIC
http://
Fujitsu, Ltd.
NXP Semiconductors N.V.
|
| GS72108TP-8I GS72108J-10 GS72108J-10I GS72108J-12 |
256K X 8 STANDARD SRAM, 12 ns, PDSO44
256K X 8 STANDARD SRAM, 10 ns, PDSO44
TV 4C 4#12 SKT RECP 256K × 8Mb异步SRAM
256K x 8 2Mb Asynchronous SRAM 256K × 82Mb异步SRAM
TV 15C 14#20 1#16 SKT RECP 256K × 8Mb异步SRAM
256K X 8 STANDARD SRAM, 10 ns, PDSO36 0.400 INCH, SOJ-36
TV 5C 5#16 PIN RECP 256K × 8Mb异步SRAM
256K X 8 STANDARD SRAM, 8 ns, PDSO36 0.400 INCH, SOJ-36
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:37; Connector Shell Size:15; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight 256K × 8Mb异步SRAM
|
ETC
GSI Technology, Inc.
Electronic Theatre Controls, Inc.
GSI[GSI Technology]
|
| AS7C33256NTF32_36A AS7C33256NTF32-36A.V.1.1 AS7C33 |
3.3V 256K x 2/36 Flowthrough Synchronous SRAM with NTD 256K X 32 ZBT SRAM, 8.5 ns, PQFP100
3.3V 256K x 2/36 Flowthrough Synchronous SRAM with NTD 256K X 32 ZBT SRAM, 10 ns, PQFP100
3.3V 256K x 2/36 Flowthrough Synchronous SRAM with NTD 256K X 36 ZBT SRAM, 8.5 ns, PQFP100
3.3V 256K x 2/36 Flowthrough Synchronous SRAM with NTD 256K X 36 ZBT SRAM, 7.5 ns, PQFP100
DIODE ZENER SINGLE 1000mW 24Vz 10.5mA-Izt 0.05 5uA-Ir 18.2Vr DO41-GLASS 5K/REEL
DIODE ZENER SINGLE 1000mW 36Vz 7mA-Izt 0.05 5uA-Ir 27.4Vr DO41-GLASS 5K/REEL
From old datasheet system
NTD? Sync SRAM - 3.3V
|
Alliance Semiconductor, Corp.
ALSC[Alliance Semiconductor Corporation]
|
|
