PART |
Description |
Maker |
X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT PACKAGE OUTLINE DIMENSIONS SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
SOT353 U-DFN3030-12 U-DFN3030-8 U-DFN3030-10 U-DFN |
SUGGESTED PAD LAYOUT SUGGESTED PAD LAYOUT
|
Diodes Incorporated http://
|
ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
IL3R-HX5F12.5-32.768 |
4 Pad Plastic Package, 1.4 mm x 7 mm
|
ILSI America LLC
|
ILCX18-GHDF18-20.000 ILCX18-BI1F18-20.000 ILCX18-B |
4 Pad Ceramic Package, 2 mm x 2.5 mm 4 Pad Ceramic Package, 2 mm x 2.5 mm
|
ILSI America LLC
|
SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|
AD8195ACPZ |
1:1 HDMI/DVI Buffer with Equalization; Package: LFCSP (6x6mm w/4.1mm pad); No of Pins: 40; Temperature Range: Industrial SPECIALTY CONSUMER CIRCUIT, QCC40
|
Amphenol, Corp.
|
OL-STRIPE |
The light source of the OL-Stripe series is suggested the Everlight LED T5 Cobra light tube.
|
Everlight Electronics Co., Ltd
|
ADL5570ACPZ-R7 ADL5570-15 |
2.3 GHz to 2.4 GHz WiMAX Power Amplifier; Package: LFCSP (4x4mm, 1.80mm exposed pad); No of Pins: 16; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
18101RC MM58274CV |
National MM58274CV 20-Pin PLCC-to-16-Pin DIP Pkg Converter A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout
|
Aries Electronics, Inc.
|