| PART |
Description |
Maker |
| ESS107M016AE2EA |
ESS, Aluminum Electrolytic, 105C, 100 uF, 20%, 16 V, -40/ 105C, Lead Spacing = 2.5mm
|
Kemet Corporation
|
| ALA8DA391DC400 |
ALA8D, Aluminum Electrolytic, 105C, 390 uF, 20%, 400 VDC, -40/ 105C
|
Kemet Corporation
|
| ELG478M035AR1AA |
Aluminum Electrolytic, 105C, ELG, 4700 uF, 20%, 35 V, -40/ 105C
|
Kemet Corporation
|
| ALS80A823MF063 |
Aluminum Electrolytic, 105C, ALS80, 0.082 F, 20%, 63 V, -40/ 105C
|
Kemet Corporation
|
| PUMA67S16000M-025 PUMA2S16000I-45 PUMA67S16000I-45 |
150NS, PLCC, COM TEMP(FLASH)
15NS, 44 PLCC, COM TEMP(EPLD)
30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA)
20NS, 44 PLCC, COM TEMP(EPLD)
150NS, TSOP, IND TEMP(FLASH)
20NS, 44 TQFP, IND TEMP(EPLD)
120NS, SOIC, IND TEMP(EEPROM)
70NS, TSOP, IND TEMP(EEPROM)
15NS, 68 PLCC, IND TEMP(EPLD)
25NS, 68 PLCC, IND TEMP(EPLD)
30MHZ, 32 TQFP, COM TEMP(FPGA)
120NS, PDIP, IND TEMP(EEPROM)
32 MCROCELL CPLD 1.8V ISP TQFP IND GREEN(EPLD)
x32 SRAM Module X32号的SRAM模块
90NS, TSOP, IND TEMP(EEPROM) X32号的SRAM模块
120NS, PLCC, IND TEMP(EEPROM)
|
DB Lectro, Inc.
TE Connectivity, Ltd.
|
| B-008-13 B-008-14 B-008-11 B-008-15 011829-000 |
SOLDERSLEEVE* WIRE TO WIRE SPLICE, LOW TEMPERATURE
|
Tyco Electronics
|
| EKZM350ESS101MF11D EKZM350ESS102MK20S EKZM350ESS12 |
Low impedance, 105C
|
United Chemi-Con, Inc.
|
| EST157M025AG3AA |
Aluminum Electrolytic, 105C LowZ, EST, 150 uF, 20%, 25 V, -40/ 105C, Lead Spacing = 3.5mm
|
Kemet Corporation
|
| A758KK827M0JAAE013 |
Polymer Aluminum, 105C LowZ, A758, 820 uF, 20%, 6.3 V, -55/ 105C, Lead Spacing = 3.5mm
|
Kemet Corporation
|
| EST129M6R3AN1AA |
Aluminum Electrolytic, 105C LowZ, EST, 0.012 F, 20%, 6.3 V, -40/ 105C, Lead Spacing = 7.5mm
|
Kemet Corporation
|
| EST128M050AM2AA |
Aluminum Electrolytic, 105C LowZ, EST, 1200 uF, 20%, 50 V, -40/ 105C, Lead Spacing = 7.5mm
|
Kemet Corporation
|
| A758KK827M0EAAE015 |
Polymer Aluminum, 105C LowZ, A758, 820 uF, 20%, 2.5 V, -55/ 105C, Lead Spacing = 3.5mm
|
Kemet Corporation
|
|
