| PART |
Description |
Maker |
| 081029132758 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| DFN1006-2 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132746 SOT-143 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| SSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN7X7-48 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO220F |
Package Outline
|
Global Mixed-mode Techn...
|
