PART |
Description |
Maker |
TQP9058H-15 |
Multi-Mode / Multi-Band Power Amplifier Module
|
TriQuint Semiconductor
|
SKY77601 |
Multi-Mode Multi-Band Power Amplifier Module
|
Skyworks Solutions
|
S70WS512N00BAWA20 S70WS512N00BAWAA3 S70WS512N00BFW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
|
SPANSION[SPANSION]
|
49-1540-6000-B 49-1540-8000-B 49-3940-8000-B 49-39 |
Uncooled Multi-Mode Pump Module
|
JDS Uniphase Corporation
|
M36L0R7040B0 M36L0R7040B0ZAQE M36L0R7040B0ZAQF M36 |
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 16 Mbit PSRAM, 1.8V Supply, Multi-Chip Package
|
ST Microelectronics STMicroelectronics
|
TQM7M5005H |
GSM/EDGE Multi-mode Power Amplifier Module
|
TriQuint Semiconductor
|
CYM74A430PM-60 CYM74S430PM-60 CYM74S431PM-66 CYM74 |
x64 Interleaved Burst Mode SRAM Module x64 SRAM Module X64的静态存储器模块
|
Cypress Semiconductor, Corp.
|
TQM766012 |
Multi-mode (WCDMA B2 / CDMA BC1 / HSPA / LTE) 3x3mm PA Module
|
TriQuint Semiconductor
|
AM42BDS640AG AM42BDS640AGBC8IT AM42BDS640AGBC8IS A |
64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation, Burst Mode Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices] SPANSION[SPANSION]
|
AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30 64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22 256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22 1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22 128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18 64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
DPS128X16A3-85M DPS128X16H3-85M DPS128X16H3-85B DP |
256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CPGA50 CERAMIC, MODULE, SLCC, PGA-50 256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQFP48 GULLWING, SLCC-48 256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQIP48 SLCC-48
|
Twilight Technology, Inc.
|