| PART |
Description |
Maker |
| 90-0092 |
PACKAGE LAND PATTERN, (U8) UMAX 8 LEAD
|
Maxim Integrated Products
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| SOT263 |
Package outline
|
NXP
Philips Semiconductors
|
| TDFN3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.8X6.2-44 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO220TF |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-3 SOT323 |
Package Outline
|
Global Mixed-mode Techn...
|
