| PART |
Description |
Maker |
| DDS040-347TG DDS010-347TG DDS030-347TG DDS050-168T |
40 POS DUAL ROW SOCKET DIP80, IC SOCKET
10 POS DUAL ROW SOCKET DIP20, IC SOCKET
30 POS DUAL ROW SOCKET DIP60, IC SOCKET
50 POS DUAL ROW SOCKET DIP100, IC SOCKET
20 POS DUAL ROW SOCKET DIP40, IC SOCKET
10 POS SINGLE ROW ADAPTER SIP10, IC SOCKET
20 POS SINGLE ROW ADAPTER SIP20, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| ZP7-50-S-G ZP7-50-S-G2T ZP7-10-A-G ZP7-10-A-G2T ZP |
180隆? / 90隆? - TH Dual Row Box Header
180掳 / 90掳 - TH Dual Row Box Header
180° / 90° - TH Dual Row Box Header
|
Yamaichi Electronics Co., Ltd.
http://
|
| D2864-01 D2808-21 D2824-21 D2922-01 D2808-01 D2818 |
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 64-way DIP24, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 8-way DIP48, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 22-way DIP22, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 8-way DIP48, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 18-way DIP18, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 20-way DIP40, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 32-way DIP32, IC SOCKET
|
Harwin PLC
|
| 87797-1200 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height
|
Molex Electronics Ltd.
|
| 87939-4001 0879394001 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating, 6.40mm(.251)
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0039299024 39-29-9024 5566-02B2GS |
4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic Selective Plating, with Drain Holes
|
Molex Electronics Ltd.
|
| HPH2RA-XX-U-SMT-118-P-HT |
DUAL ROW PIN HEADER
|
Adam Technologies, Inc.
|
| D2PH-2-XX-U-CDE |
DUAL ROW PIN HEADER
|
Adam Technologies, Inc.
|
| RSM2-XX-SG-SMT-10-P-PP-TR |
DUAL ROW FEMALE HEADER
|
Adam Technologies, Inc.
|
| D2PH-2-XX-SG-180-SMT-425 |
DUAL ROW PIN HEADER
|
Adam Technologies, Inc.
|
|
