| PART |
Description |
Maker |
| MAX16123WTAR31 MAX16125WTAN16T MAX16123WTAR31T MAX |
Dual Pushbutton Controllers in Tiny 6-Bump WLP Package
|
MAXIM - Dallas Semiconductor
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| TQFN3.8X6.2-44 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.5X3.5-14 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN7X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| LQFP44 |
Package outline
|
Philips
|
| TSSOP-14-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT416 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
