| PART |
Description |
Maker |
| ZTT-MT-20.000 ZTT-MX-20.000 ZTT-MG-20.000 ZTA ZTA- |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ILCX04-GHD318-20.000 ILCX04-GHDF18-20.000 ILCX04-B |
4 Pad Ceramic Package, 5 mm x 7 mm
4 Pad Ceramic Package, 5 mm x 7 mm
|
ILSI America LLC
|
| ILCX07-GHD318-20.000 ILCX07-GHDF18-20.000 ILCX07-B |
4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
|
ILSI America LLC
|
| ILCX19-JF0F18-20.000 ILCX19-JF1F18-20.000 ILCX19-J |
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm
|
ILSI America LLC
|
| LXZT-374KHZ LXZT-429KHZ LXZT-249KHZ LXZT-375KHZ LX |
CERAMIC RESONATOR, 0.374 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.429 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.249 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.375 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.999 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
|
Abracon, Corp.
|
| 21-0111 |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
|
Maxim Integrated Products
|
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| IL3S-HJ9F18-20.000 IL3S-JH9F18-20.000 IL3S-BI9F18- |
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
|
ILSI America LLC
|
| ACT320SMX-4 |
low cost, 4 pad, high quality, low aging 3X2.5mm SMD Crystal in a ceramic base
|
Advanced Crystal Technology
|
| 12.000MQ22030-101860 12.000MQ2030-101860 MQ2 MQ203 |
7 x 5mm SMD, 4 pad or 2 pad
|
EUROQUARTZ limited
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
