PART |
Description |
Maker |
IT3D-300S-BGA TR0636E-20027 |
IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT
|
Hirose Electric
|
CXK77P36E160GB-43BE CXK77P18E160GB-4BE CXK77P18E16 |
1M X 18 STANDARD SRAM, 3.7 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 1M X 18 STANDARD SRAM, 4.5 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 1M X 18 STANDARD SRAM, 3.8 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 1M X 18 STANDARD SRAM, 4.1 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 16Mb LW R-L HSTL High Speed Synchronous SRAMs (512K x 36 or 1M x 18) 16Mb的龙运RL HSTL高速同步静态存储器(为512k × 3600万18 CAP 820PF 50V 20% X7R SMD-0603 TR-7 PLATED-NI/SN
|
http:// Yuasa Battery, Inc. Integrated Circuit Technology Corp Microsemi, Corp. Sony, Corp. Sony Corporation
|
ELANSC520-100AC ELANSC520-100AI |
PLASTIC BGA, CAVITY UP(BGA)
|
ADVANCED MICRO DEVICES INC
|
IA1215S IA1215D IA1212D IA1209S IA0509D IA0509S IA |
Analog IC 模拟IC 316 POS BGA EXT. SOCKET 316 POS 1.27MM BGA EXT. SOCKET 313 POS 1.27MM BGA EXT. SOCKET
|
Electronic Theatre Controls, Inc. XP Power, Ltd.
|
IBM25PPC740L-GB375A2T IBM25PPC740L-GB375A2R IBM25P |
MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|CERAMIC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC 微处理器| 32位|的CMOS | BGA封装| 255PIN |陶瓷
|
Glenair, Inc. Vishay Semiconductors
|
IBM25PPC405GP-3BE266C IBM25PPC405GP-3EE200C IBM25P |
MICROPROCESSOR|32-BIT|CMOS|BGA|413PIN|PLASTIC MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC 微处理器| 32位|的CMOS | BGA封装| 456PIN |塑料
|
Jameco Electronics Mitel Networks, Corp.
|
TSC51C2XXX-12IB TSC51C2XXX-16IB TSC51C2XXX-A12IB T |
IC MAX 7000 CPLD 512 208-PQFP IC MAX IIZ CPLD 570 LE 256-MBGA IC MAX 7000 CPLD 512 256-FBGA 484-pin FineLine BGA RoHS Compliant: Yes 956-pin BGA RoHS Compliant: Yes IC,FPGA,32470-CELL,CMOS,BGA,1020PIN,PLASTIC FPGA Logic IC Logic Type:FPGA; No. of Macrocells:726; Package/Case:1020-BGA; Leaded Process Compatible:No; Number of Circuits:32; IC,FPGA,4800-CELL,CMOS,BGA,484PIN,PLASTIC IC,FPGA,10570-CELL,CMOS,BGA,672PIN,PLASTIC IC,FPGA,14400-CELL,CMOS,BGA,780PIN,PLASTIC No. of Macrocells:192; No. of Pins:68; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes; No. of Macrocells:192; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes; No. of Macrocells:160; No. of Pins:84; Operating Temp. Max:70 C; Operating Temp. Min:0 C; Propagation Delay:10ns RoHS Compliant: Yes; No. of Macrocells:440; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:9ns RoHS Compliant: Yes; 8-BIT MICROCONTROLLER 8位微控制 IC MAX 7000 CPLD 128 100-PQFP 8位微控制 IC MAX 7000 CPLD 160 84-PLCC 8位微控制
|
TE Connectivity, Ltd. Diodes, Inc. Semtech, Corp.
|
IBM25PPC740-DB0M2660 IBM25PPC740-EB0M2660 IBM25PPC |
32-BIT, 266 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 233 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
|
Japan Aviation Electronics Industry, Ltd.
|
MT49H8M32BM-4 MT49H8M32FM-4 |
8M X 32 DDR DRAM, PBGA144 11 X 18.50 MM, LEAD FREE, MICRO, BGA-144 8M X 32 DDR DRAM, PBGA144 11 X 18.50 MM, MICRO, BGA-144
|
NEC, Corp.
|
IBM25PPC405EP-3GA133C IBM25PPC405EP-3GA200C IBM25P |
32-BIT, 133.33 MHz, RISC PROCESSOR, PBGA385 31 X 31 MM, ENHANCED, PLASTIC, BGA-385 32-BIT, 200 MHz, RISC PROCESSOR, PBGA385 31 X 31 MM, ENHANCED, PLASTIC, BGA-385 32-BIT, 266.66 MHz, RISC PROCESSOR, PBGA385 31 X 31 MM, ENHANCED, PLASTIC, BGA-385
|
Electronic Theatre Controls, Inc.
|
K7P323688M-HC250 K7P323688M-GC250 |
1M X 36 LATE-WRITE SRAM, 2 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 1M X 36 LATE-WRITE SRAM, 2 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANCE, BGA-119
|
TOKO, Inc.
|
M5LV-512/256-10SAI M5LV-512/256-12SAC M5LV-256/160 |
EE PLD, 10 ns, PBGA352 BGA-352 EE PLD, 12 ns, PBGA352 BGA-352 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP160 Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP100 Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP160 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP160 EE PLD, 15 ns, PBGA352 BGA-352 Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP144 EE PLD, 15 ns, PQFP160 PLASTIC, QFP-160 CONNECTOR ACCESSORY EE PLD, 5.5 ns, PQFP100 Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 7.5 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP100 EE PLD, 15 ns, PQFP100 TQFP-100 Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP208 EE PLD, 12 ns, PQFP100 TQFP-100 EE PLD, 12 ns, PBGA256 BGA-256
|
Lattice Semiconductor, Corp. LATTICE SEMICONDUCTOR CORP
|
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