| PART |
Description |
Maker |
| PC93-20-5-2 |
Non-Silicone Thermal Conductive Pad
|
List of Unclassifed Man...
|
| 16192 16192-7 |
THERMAL INTERFACE PAD, (MICRO) 热接口垫，（微）
THERMAL INTERFACE PAD (MICRO)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| 19459 19459-3 |
THERMAL INTERFACE PAD (VI-200)
THERMAL INTERFACE PAD, (VI-200)
|
VICOR[Vicor Corporation]
|
| HSP-7 |
Thermal Pad suitable for NOVA22 Panel Mount SSRs
|
Crydom Inc.,
|
| P1BR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| KF3006-GM50A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KD2003-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
