PART |
Description |
Maker |
LSSHS-5-04 |
Recommended P.C.B.Layout
|
Major League Electronics
|
X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT PACKAGE OUTLINE DIMENSIONS SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
XCR3032XL-10PCG44I XCR3032XL-5PCG44C XCR3032XL-10P |
XCR3032XL-10PCG44I - NOT RECOMMENDED for NEW DESIGN EE PLD, 10 ns, PQCC44 XCR3032XL-5PCG44C - NOT RECOMMENDED for NEW DESIGN EE PLD, 5 ns, PQCC44 XCR3032XL-10PCG44C - NOT RECOMMENDED for NEW DESIGN EE PLD, 10 ns, PQCC44
|
Xilinx, Inc.
|
HSDL-1100008 HSDL-1100018 HSDL-1100007 HSDL-110001 |
IrDA 1.1 Compliant 4Mb/s 5V Transceiver. Top Option.Tape & ReelLINot Recommended for New Designs) IrDA 1.1Compliant 4Mb/s 5V Transceiver. Top Opt. 10 units/stripLINot Recommended for New Designs) IrDA 1.1Compliant 4Mb/s 5V Transceiver.Front Option.Tape & Reel<LINot Recommended for New Designs) 红外1.1Compliant 4Mb sV的Transceiver.Front Option.Tape IrDA 1.1Compliant 4Mb/s 5V Transceiver.Front Opt.10 units/strip<LINot Recommended for New Designs) 红外1.1Compliant 4Mb sV的Transceiver.Front Opt.10单位/条\u0026lt;LI\u0026gt;(不推荐用于新设计)
|
Ecliptek, Corp.
|
AN-5061 |
Layout Guidelines
|
Fairchild Semiconductor Corporation
|
2SC3329 E000833 |
NPN EPITAXIAL TYPE (FOR LOW NOISE AUDIO AMPLIFIER APPLICATIONS AND RECOMMENDED FOR THE FIRST STAGES OF MC HIAD AMPLIFIERS) From old datasheet system FOR LOW NOISE AUDIO AMPLIFIER APPLICATIONS AND RECOMMENDED FOR THE FIRST STAGES OF MC HEAD AMPLIFIERS
|
TOSHIBA[Toshiba Semiconductor]
|
TLV320AIC25IPFBR TLV320AIC25IPFB TLV320AIC25CPFBR |
Layout and Grounding Guidelines for TLV320AIC2x
|
TI
|
PG-TO251-3-21 |
Package Outline / Marking Layout
|
Infineon
|