| PART |
Description |
Maker |
| 1FGS304-551TG MGS272-636TT FBS225-551GG FBS225-551 |
304 POS FR-4 BGA SOCKET BGA304, IC SOCKET
272 POS 1.27MM BGA SOCKET BGA272, IC SOCKET
225 POS FR-4 BGA SOCKET BGA225, IC SOCKET
521 POS FR-4 BGA SOCKET BGA521, IC SOCKET
303 POS FR-4 BGA SOCKET BGA303, IC SOCKET
540 POS FR-4 BGA SOCKET BGA540, IC SOCKET
456 POS FR-4 BGA SOCKET BGA456, IC SOCKET
475 POS FG4 BGA SOCKET BGA475, IC SOCKET
400 POS 1.27MM BGA SOCKET
BGA240, IC SOCKET
BGA400, IC SOCKET
BGA121, IC SOCKET
BGA396, IC SOCKET
BGA256, IC SOCKET
169 POS FR-4 BGA SOCKET
BGA169, IC SOCKET
432 POS FR-4 BGA SOCKET
BGA204, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| IBM25PPC440GP-3CC400E IBM25PPC440GP-3CC400C IBM25P |
32-BIT, 400 MHz, RISC PROCESSOR, CBGA552 25 X 25 MM, CERAMIC, BGA-552
32-BIT, 400 MHz, RISC PROCESSOR, PBGA552 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552
32-BIT, 466 MHz, RISC PROCESSOR, PBGA552 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552
32-BIT, 500 MHz, RISC PROCESSOR, PBGA552 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552
|
Applied Micro Circuits, Corp.
Electronic Theatre Controls, Inc.
|
| IBM25PPC740-DB0M2660 IBM25PPC740-EB0M2660 IBM25PPC |
32-BIT, 266 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 233 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 200 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
|
Japan Aviation Electronics Industry, Ltd.
|
| GDPXA255A0C400 GDPXA255A0E200 GDPXA255A0C200 GDPXA |
32-BIT, 400 MHz, MICROPROCESSOR, PBGA256 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-256
32-BIT, 200 MHz, MICROPROCESSOR, PBGA256 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-256
32-BIT, 300 MHz, MICROPROCESSOR, PBGA256 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-256
|
Intel, Corp.
INTEL CORP
|
| UPD44325084F5-E37-EQ2-A UPD44325084F5-E50-EQ2-A UP |
4M X 8 QDR SRAM, 0.45 ns, PBGA165 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165
4M X 8 QDR SRAM, 0.45 ns, PBGA165 13 X 15 MM, PLASTIC, BGA-165
|
NEC, Corp.
|
| MT49H8M32BM-4 MT49H8M32FM-4 |
8M X 32 DDR DRAM, PBGA144 11 X 18.50 MM, LEAD FREE, MICRO, BGA-144
8M X 32 DDR DRAM, PBGA144 11 X 18.50 MM, MICRO, BGA-144
|
NEC, Corp.
|
| K7P401823B-HC650 K7P401823B-HC750 K7P403623B |
256K X 18 STANDARD SRAM, 6.5 ns, PBGA119 14 X 22 MM, BGA-119
256K X 18 STANDARD SRAM, 7.5 ns, PBGA119 14 X 22 MM, BGA-119
128Kx36 & 256Kx18 SRAM
|
Samsung semiconductor
|
| W9864G2DB-7 |
BGA SDRAM
|
Winbond Electronics
|
| M5LV-512/256-10SAI M5LV-512/256-12SAC M5LV-256/160 |
EE PLD, 10 ns, PBGA352 BGA-352
EE PLD, 12 ns, PBGA352 BGA-352
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP160
EE PLD, 15 ns, PBGA352 BGA-352
Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP144
EE PLD, 15 ns, PQFP160 PLASTIC, QFP-160
CONNECTOR ACCESSORY EE PLD, 5.5 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 7.5 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP100
EE PLD, 15 ns, PQFP100 TQFP-100
Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP208
EE PLD, 12 ns, PQFP100 TQFP-100
EE PLD, 12 ns, PBGA256 BGA-256
|
Lattice Semiconductor, Corp.
LATTICE SEMICONDUCTOR CORP
|
|
