| PART |
Description |
Maker |
| SOT340-1 |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| IS210 |
SMALL OUTLINE PHOTO DMOS-FET RELAY WITH HIGH LOAD VOLTAGE CAPABILITIES
|
ISOCOM COMPONENTS
|
| IS216D |
Small Outline Photo DMOS-FET Relay with very high load current capabilities( 5A )
|
ISOCOM COMPONENTS
|
| HYM328000GD-60 HYM328000GD- 328000 HYM328000GD-50 |
-8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
8M x 32 Bit DRAM Module (SO-DIMM)
From old datasheet system
8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 8M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
|
Siemens Semiconductor G...
Infineon
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
|
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| S5PACKAGE |
Plastic Small Outline Ics
|
Cypress Semiconductor
|
| LCQT-TSSOP20 LCQT-TSSOP28 LCQT-TSSOP16 LCQT-TSOP32 |
Small Outline Prototyping Adapters
|
Aries Electronics, Inc.
|
| MT8LSDT1664 MT8LSDT1664H MT8LSDT1664HG-10C MT8LSDT |
SMALL-OUTLINE SDRAM MODULE
|
MICRON[Micron Technology]
|
| SSOP24 |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
STMicroelectronics
ST Microelectronics
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
