PART |
Description |
Maker |
M52-5102545 M52-5012945 |
1.27mm Pitch DIL Vertical PC Tail Socket Assembly, 4.6mm height, gold, 25 25-way 50 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET 1.27mm Pitch SIL Vertical PC Tail Socket Assembly, 8.5mm height, gold, 29-way
|
Harwin PLC HARWIN INC
|
M52-5110945 111245 |
1.27mm Pitch DIL Vertical PC Tail Socket Assembly, 8.5mm height, gold, 9 9-way 18 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET 1.27mm Pitch DIL Vertical PC Tail Socket Assembly, 8.5mm height, gold, 12 12-way
|
Harwin PLC HARWIN INC
|
0877823007 |
0.60mm Pitch miniDIMM DDR3 Socket, Vertical, Surface Mount, 0.76m Gold
|
Molex Electronics Ltd.
|
0877823009 |
0.60mm Pitch miniDIMM DDR3 Socket, Vertical, Surface Mount, 0.76m Gold
|
Molex Electronics Ltd.
|
78079-0201 0780790201 |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins
|
Molex Electronics Ltd.
|
0785430151 78543-0151 |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38渭m (15渭) Gold (Au) Plating 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38μm (15μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
0783210001 78321-0001 |
1.00mm (.039) Pitch DDR3 DIMM Socket, LLCR, Vertical, Through Hole, with Beveled Metal Pins 1.00mm (.039") Pitch DDR3 DIMM Socket, LLCR, Vertical, Through Hole, with Beveled Metal Pins
|
Molex Electronics Ltd.
|
0780790052 78079-0052 |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38渭m (15渭) Gold(Au) Plating 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38μm (15μ) Gold(Au) Plating
|
Molex Electronics Ltd.
|
D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922 |
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 24-way DIP24, IC SOCKET 2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin, 24-way DIP24, IC SOCKET 2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 40-way DIP40, IC SOCKET DIP22, IC SOCKET
|
Harwin PLC HARWIN INC
|
78079-0002 0780790002 |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.38μm (15μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
M20-E020446 |
2.54mm Pitch DIL Vertical PC Tail Socket Assembly, tin, 4 4-way - twin beam contact 8 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
|
Harwin PLC
|
M20-E011046 |
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, tin, 10-way - twin beam contact 10 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
|
Harwin PLC
|
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