| PART |
Description |
Maker |
| CM1205-16CS CM1205 CM1205-04CS CM1205-08CS CM1205- |
ESD Protection Arrays, Chip Scale Package ESD保护阵列，芯片级封装
4, 8 and 16-Channel ESD Protection Arrays in Chip Scale Package with OptiGuard™ Coating (PACDN14xxC pin compatible)
|
California Micro Devices Corporation
CALMIRCO[California Micro Devices Corp]
|
| ADG784 ADG784BCP |
ADMC200 & ADMC201 Motion Coprocessors
CMOS 3 V/5 V Wide Bandwidth Quad 2:1 Mux in Chip Scale Package
CMOS 3 V/5 V/ Wide Bandwidth Quad 2:1 Mux in Chip Scale Package
CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux in Chip Scale Package
|
AD[Analog Devices]
|
| SDM02U30CSP SDM02U30CSP-7 |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes Incorporated
|
| FCSP07H40TR |
Chip Scale Package Schottky Barrier Rectifier, 0.75 A
|
Vishay Siliconix
|
| FCSP0730TR |
Chip Scale Package Schottky Barrier Rectifier, 0.75 A
|
Vishay Siliconix
|
| FCSP230LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| SDM0230CSP |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes Incorporated
|
| FCSP130LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| PACDN2404CG |
ESD Protection Arrays, 4, 8 and 16 Channel, Chip Scale Package
|
California Micro Devices Corp
|
| ADG784BCPZ ADG784BCPZ-REEL ADG784BCPZ-REEL7 ADG784 |
CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux in Chip Scale Package
|
Analog Devices
|
| 28F3204C3 |
3 V Advanced Stacked Chip Scale Package Memory(3V高级堆芯片封装存储器) 3伏高级堆叠芯片级封装存储器（3V的高级堆芯片封装存储器）
|
Intel, Corp.
|
| CB-9-1 |
9-Ball Wafer Level Chip Scale Package [WLCSP] Dimensions shown in millimeters
|
Analog Devices
|
