| PART |
Description |
Maker |
| ADF4602BCPZ-RL |
Single-Chip, Multiband 3G Femtocell Transceiver; Package: LFCSP: Leadform Chip Scale; No of Pins: 40; Temperature Range: Ind TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC40
|
Analog Devices, Inc.
|
| FCSP240LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP1H40ETR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP0730TR |
Chip Scale Package Schottky Barrier Rectifier, 0.75 A
|
Vishay Siliconix
|
| FCSP230LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP2H40LTR FCSP2H40LTR11 |
FlipKY, 1.5 A Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP130LTR FCSP130LTR11 |
FlipKY, 1 A Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| ADG781 ADG781BCP ADG782 ADG782BCP |
2.5 ohm Quad SPST Switches in Chip Scale Package
|
Analog Devices
|
| MAX16072RSD MAX16073RSD MAX16074RSD MAX16072 MAX16 |
楼矛P Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package
μP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package
|
Maxim Integrated Products
|
| 28F1602C3 28F3204C3 29066605 |
3 Volt Advanced Stacked Chip Scale Package Memory
From old datasheet system
|
Intel
|
