| PART |
Description |
Maker |
| 081029132611 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| DFN1006-2 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| X2-DFN0806-3 X3-DFN0603-2 X1-DFN1212-3 X1-DFN1006- |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| 369A-13 |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| TO-247ACPACKAGE |
Case Outline and Dimensions
|
International Rectifier
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT
PACKAGE OUTLINE DIMENSIONS
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
