| PART |
Description |
Maker |
| JE10 JE1046ZTL2R JE10112HL1 JE10112HL1R JE10112HL2 |
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 1.1pF; Voltage: 100V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 50V; Tolerance: ±1%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 50V; Tolerance: ±10%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
MINIATURE HIGH POWER LATCHING RELAY 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 1.2pF; Voltage: 50V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
MINIATURE HIGH POWER LATCHING RELAY
|
HONGFA[Hongfa Technology]
厦门宏发电声股份有限公司
Xiamen Hongfa Electroacoustic Co., Ltd.
???瀹???靛０?′唤??????
|
| M55342K12B2B80R |
QPL MIL-PRF-55342 Qualified Thin Film Resistor Chips
|
Vishay Siliconix
|
| 5962R9059001BDA 5962R9059001BCA 5962R9059001B2A 59 |
Low-Power, Fixed and Adjustable Reference with Shutdown in SOT23
Digitally Controlled, 0.5% Accurate, Safest APD Bias Supply 十六进制逆变
CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
|
Microchip Technology, Inc.
|
| FM10A125V1/2A 340267 FM08A25V21/2A FM10A125V11/2A |
Hook-Up Wire; Conductor Size AWG:24; No. Strands x Strand Size:19 x 36; Jacket Color:Black; Approval Bodies:UL; Approval Categories:UL AWM Style 1371; Passes VW-1 Flame Test; Cable/Wire MIL SPEC:MIL-W-16878/6 Type ET RoHS Compliant: Yes
Military Fuses and Fuseholders - Fuses 军事保险丝和保险保险
Approved to MIL-PRF-15160
Approved to MIL-PRF-15160
|
Littelfuse, Inc.
|
| 54F04/B2C 54F04/BDA 54F04/B2A |
CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
|
Glenair, Inc.
|
| CDR32BX109BBSM CDR32BX129ABSP CDR32BX109BBSR CDR32 |
CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
|
电容
KEMET Corporation
TT electronics Semelab, Ltd.
|
| 74AHCT04D-T 74AHCT04PW-T |
CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
|
NXP Semiconductors N.V.
|
| T323A474J035AS-C T323A474J035AT-C T323A474K035AS-C |
TANTALUM MOLDED
DISSIPATION FACTOR: Maximum DF limits are shown in corresponding series part number listings on pages 44-48. See Application Notes Section, page 76 for addi-tional
PERFORMANCE CHARACTERISTICS
TANTALUM MOLDED / AXIAL ?MIL-PRF-49137/1&5
TANTALUM MOLDED / AXIAL . MIL-PRF-49137/1&5
|
Kemet Corporation
|
| SFMC28-461 SFMC28-461F |
Operating temperature -55掳 to 125掳C Qualified to MIL-PRF-38534 Class H and K
Operating temperature -55° to 125°C Qualified to MIL-PRF-38534 Class H and K
|
Interpoint Corporation Company
|
| M3253504E1C101JZMB-R M3253504E1C101JZMB-T |
SMD MIL C0G PRF32535, Ceramic, Military/High Reliability, 100 pF, 5%, 200 V, C0G, SMD, Low ESR, MIL-PRF-32535, N/A, 0805
|
Kemet Corporation
|
