| PART |
Description |
Maker |
| FX614 |
CML Semiconductor Products Bell 202 Compatible Modem
|
CML Microcircuits
|
| CMX624 |
V.23 / Bell 202 Modem
|
CML Microcircuits
|
| CMX644AD2 CMX644AD5 |
V.22 and Bell 212A Modem
|
CML Microcircuits
|
| XR2129 XR2128 XR2126 XR2127 XR-2126 XR-2127 XR-212 |
Bell 212A / CCITT V.22 Modem Filters
|
Exar
|
| 73K324BL-IH 73K324BL-IGT 73K324BL |
22bis/V.22/V.21/V.23 Bell 212A Single-Chip Modem w/Integrated Hybrid
CONN, SHROUDED HDR, 34PIN, MALE, 0.100
Four Wall Header; No. of Contacts:34; Pitch Spacing:0.1"; No. of Rows:2; Gender:Header; Body Material:Glass-filled Polyester; Contact Plating:Nickel; Leaded Process Compatible:No; Mounting Type:Through Hole RoHS Compliant: No 单芯片调制解调器瓦特/集成混合
|
List of Unclassifed Manufacturers
http://
TDK Semiconductor
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| 2N6558 2N6559LEADFREE |
0.5 A, 300 V, NPN, Si, POWER TRANSISTOR, TO-202
0.5 A, 350 V, NPN, Si, POWER TRANSISTOR, TO-202
5-Pin µP Supervisory Circuits with Watchdog and Manual Reset
|
CENTRAL SEMICONDUCTOR CORP
|
| MX919LH MX919J NBSPMX919JNBSP |
MODEM CIRCUIT,MODEM,CMOS,LDCC,24PIN,PLASTIC
MODEM CIRCUIT,MODEM,CMOS,DIP,24PIN,CERAMIC
From old datasheet system
|
MX-COM Inc
|
| MRCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215
|
Vishay
|
| MC145442P MC145442DW |
MODEM CIRCUIT,MODEM,CMOS,DIP,20PIN,PLASTIC
MODEM CIRCUIT,MODEM,CMOS,SOP,20PIN,PLASTIC
From old datasheet system
|
Motorola Semiconductor Products Inc
|
| ML7020MB |
MODEM CIRCUIT,MODEM,SOP,32PIN,PLASTIC
From old datasheet system
|
OKI Semiconductor Group
|
| TDA5051 TDA5051T TDA5051NBSP |
Home automation modem
MODEM
From old datasheet system
|
PHILIPS[Philips Semiconductors]
Philips Semiconductors
|
|
