| PART |
Description |
Maker |
| HSU277 |
Low forward resistance Ultra small Resin Package (URP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| KRBTQDLP61.3A |
SMD package with silicone resin
|
OSRAM GmbH
|
| LRT6MF |
black PLCC-2 package, colorless resin
|
OSRAM GmbH
|
| LCWCQ7P.CC LCW-CQ7P.CC |
SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
| Q62702P5178 |
SMT package 0805, colorless diffused resin, 2 mm x 1.25 mm x 0.8 mm
|
OSRAM GmbH
|
| LST656 |
white P-LCC-2 package, colorless clear resin
|
OSRAM GmbH
|
| LA-W57B |
white SMD package, colorless clear resin
|
OSRAM GmbH
|
| LH-CPDP |
SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
| GWJCLPS1.EM |
white smt package, colored diffused silicone resin
|
OSRAM GmbH
|
| GWPSLRS1.CC |
white SMT package, colored diffused silicone resin
|
OSRAM GmbH
|
| LCW-MVSG.EC |
white SMT package, colored diffused silicone resin
|
OSRAM GmbH
|
