| PART |
Description |
Maker |
| POWERSO-10 |
10LEADS POWER SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| TSSOP MSOP TSSOP-EP MSOP-EP |
SMALL OUTLINE PACKAGES
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| MT4LDT464HX |
SMALL-OUTLINE DRAM MODULE
|
Micron Technology, Inc.
|
| LCQT-TSSOP20 LCQT-TSSOP28 LCQT-TSSOP16 LCQT-TSOP32 |
Small Outline Prototyping Adapters
|
Aries Electronics, Inc.
|
| MT16LSDF3264LHY-10E MT16LSDF6464LHY-10E MT16LSDF32 |
SMALL-OUTLINE SDRAM MODULE
|
Micron Technology
|
| SO-8 |
8-LEAD SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| MINISO-8 |
8-LEAD MINI SMALL OUTLINE 8引脚小外形迷
|
STMicroelectronics N.V.
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| MOC207R2M MOC207M MOC206M MOC205M MOC207R1M |
Small Outline Optocouplers Transistor Output
|
Fairchild Semiconductor
|
| MOC223-M MOC223 |
SMALL OUTLINE OPTOCOUPLERS DARLINGTON OUTPUT
|
Fairchild Semiconductor Corporation
|
| FPT-20P-M04 |
THIN SHRINK SMALL OUTLINE PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
