| PART |
Description |
Maker |
| 28333-PCN-001-A |
Mold Compound and Die Attach Change for ETQFP Package
|
M/A-COM Technology Solutions, Inc.
|
| BYM11-50 BYM11-800 BYM11-600 BYM11-400 BYM11-100 B |
1 A, 100 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2
1 A, 1000 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2
1 A, 600 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2
Surface Mount Glass Passivated Junction Fast Switching Rectifier, Forward Current 1.0 A
|
Vishay Beyschlag
|
| 5P6SMA 5P4SMA |
5A mold isolated SCR
From old datasheet system
P gate all Diffused mold type Thyristor granted 5 A on-state Average current, with rated Voltages up to 600V
|
NEC Electronics
NEC[NEC]
NEC Corp.
|
| 2P1M-YB 2P6M-YB 2P4M-YB 2P2MYC 2P2M-YB 2P2M-CY 2P0 |
4 A, 100 V, SCR PLASTIC PACKAGE-3
4 A, 600 V, SCR PLASTIC PACKAGE-3
4 A, 400 V, SCR PLASTIC PACKAGE-3
4 A, 200 V, SCR
4 A, 50 V, SCR
|
|
| HLMP-3950-LM0VR HLMP-3750-L00VR HLMP-3590-I00VR HL |
T-1 3/4 SINGLE COLOR LED, GREEN, 5 mm PLASTIC PACKAGE-2
T-1 3/4 SINGLE COLOR LED, HIGH EFFICIENCY RED, 5 mm PLASTIC PACKAGE-2
T-1 3/4 SINGLE COLOR LED, YELLOW, 5 mm PLASTIC PACKAGE-2
|
Agilent Technologies, Inc.
Electronic Theatre Controls, Inc.
|
| 2SC5181 2SC5181-T1 |
NPN EPITAXIAL SILICON TRANSISTOR IN ULTRA SUPER MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION
ECONOLINE: RY & RX - Controllable Output- 1kVDC Isolation- No Heatsink Required- UL94V-0 Package Material- Toroidal Magnetics- No External Components- Fully Encapsulated- Efficiency to 70%
|
NEC Corp.
|
| 2SC5186-T1 2SC5186 |
From old datasheet system
NPN EPITAXIAL SILICON TRANSISTOR IN ULTRA SUPER MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION
|
NEC[NEC]
|
| PS21963-T09 PS21963-AT PS21963-CT |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
| PS21965-AT PS21965-CT PS21965-TW PS21965-T09 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
| PS21204 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Corporation
|
| PS21963-ST09 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
