| PART |
Description |
Maker |
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| PG-LQFP-64-12 PG-LQFP-64-19 PG-LQFP-64-22 PG-LQFP- |
Package Outline
|
Infineon
|
| TSSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
