PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP3X3-5 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-12 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP9X9-81 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP11X12-132 |
Package Outline
|
Global Mixed-mode Techn...
|
SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|