PART |
Description |
Maker |
088-00376 |
OUTLINE, HF2
|
API Technologies Corp
|
QSOP |
Shrink Small Outline, Quarter-Size Small-Outline Packages
|
Amkor Technology
|
PG12232-E- PG12232-E-33 |
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸 OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp. Powertip Technology Corp. POWERTIP[Powertip Technology]
|
PC1602-L |
OUTLINE DIMENSION & BLOCK DIAGRAM OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp. http://
|
16769 16769-04 |
BOX 3.4X2.56X1.02 W/0 BTNS ALMOND BOX 3.4X2.56X1.02 W/0 BTNS BLK2 OUTLINE DRAWING, HUB470-P OUTLINE DRAWING HUB470-P
|
VICOR[Vicor Corporation]
|
TQFN4X4-24 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT416 |
Package outline
|
NXP Semiconductors Philips Semiconductors
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-32 |
Package Outline
|
Global Mixed-mode Techn...
|