PART |
Description |
Maker |
0997-8-50-20-75-14-11-0 0910-1-57-20-75-14-11-0 09 |
SPRING-LOADED CONNECTORS Discrete Spring-Loaded Contacts BERYLLIUM COPPER, GOLD (10) OVER NICKEL FINISH, PCB TERMINAL
|
Mill-Max Mfg. Corp. MILL-MAX MFG CORP
|
107-1400 |
SPRING LOADED CONTACT REMOYAL TOOLS
|
Winchester Electronics Corporation
|
P70-1100045R |
SMT SPRING LOADED POGO PIN IN TAPE AND REEL
|
Harwin Plc
|
P70-1020045R P70-1000045R P70-1010045R P70-1030045 |
SMT SPRING LOADED POGO PIN IN TAPE AND REEL
|
Harwin Plc
|
806-22-001-30-002191 |
Spring-Loaded Pin with Removable Pick and Place Cap
|
Mill-Max Mfg. Corp.
|
0955016449 95501-6449 |
Modular Jacks, Low Profile, SMT Jack, 4 Positions, 4 loaded
|
Molex Electronics Ltd.
|
90130-1268 0901301268 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
90130-1240 0901301240 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
90130-1238 0901301238 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
|