| PART |
Description |
Maker |
| 121-27296-04-260 121-27296-2 121-27296-4 121-27296 |
POWER TERMINAL WITH INSULATOR 125 x 250 GRID - 6PIN
POWER TERMINAL WITH INSULATOR .125 X .250 GRID - 6 PIN
|
Winchester Electronics Corporation
Winchester Electronics ...
|
| 0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 90160-0116 90160-0164 90160-0110 90160-0150 |
CONNECTOR DUAL ROW CRIMP HOUSING 16 POSITION 16 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
C-Grid Crp Conn Hsg DR FL Polz 64Ckt 64 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
C-Grid Crp Conn Hsg DR FL Polz 10Ckt 10 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
C-Grid Crp Conn Hsg DR FL Polz 50Ckt 50 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
|
Molex, Inc.
|
| 3CX15-000A3 |
Grid driven RF amplifier
|
Communications & Power Industries, Inc.
|
| 0901210768 90121-0768 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 803-93-004-30-001000 800-10-003-30-001000 800-10-0 |
INTERCONNECTS .100隆卤 Grid (.030隆卤 dia.) Pins, Surface Mount Headers & Sockets Single and Double Row
INTERCONNECTS .100 Grid (.030 dia.) Pins, Surface Mount Headers & Sockets Single and Double Row
|
Mill-Max Mfg. Corp.
|
| SM2001 |
I.C. Socket, Pin Grid Array
|
Thomas & Betts
|
| 1016045 |
Retro-reflective light grid
|
SICK AG
|
| 0015-80-1163 001580-1163 15801163 |
2.54mm Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| MGA |
GRID HIGH-PERFORMANCE RELAYS
|
Tyco Electronics
|
| PC88 |
TRIODE FOR USE AS GROUNDED GRID U.H.F. AMPLIFIER
|
NXP Semiconductors
|
