PART |
Description |
Maker |
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
SOP-7 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-16 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP9X9-81 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|