| PART |
Description |
Maker |
| 1451320201 |
Micro-Fit TPA-to-Micro-Fit TPA Off-the-Shelf (OTS) Cable Assembly, Single Row, 150.00mm Length, 2 Circuits, Black
|
Molex Electronics Ltd.
|
| MDM-9PBSM7-L58A141 MDM-9PCBRM7-L58A141 |
Micro-D PCB - .050 Contact Spacing
|
ITT Corporation
|
| MDM-9SBSM7-L58A141 |
Micro-D PCB - .050 Contact Spacing
|
ITT Corporation
|
| 79516-1063 |
Micro-Fit Overmolded Cable Assembly, 6 Circuit, 3.0m (9.84 ) Length
|
Molex Electronics Ltd.
|
| 79516-1105 0795161105 |
Micro-Fit Overmolded Cable Assembly, 10 Circuit, 5.0m (16.40) Length
|
Molex Electronics Ltd.
|
| NJU6676 |
64Com × 132Seg plus 1-Icon common Bit Map LCD Driver
|
New Japan Radio
|
| 2-1445050-3 2-1445050-6 2-1445050-2 2-1445050-8 2- |
VERTICAL THRU HOLE HEADER ASSY, TIN CONTACTS W/PCB POLATIZATION FEATURE, SINGLE ROW, MICRO MATE-N-LOK
VERTICAL THRU HOLE HEADER ASSY, TIN CONTACTS W/PCB POLARIZATION FEATURE, SINGLE ROW, MICRO MATE-N-LOK
VERTICAL THRU HOLE HEADER ASSY, TIN CONTACTS W/PCB POLARIZATION FEATURE, SINGLE ROW MICRO MATE-N-LOK
VERTICAL THRU HOLE HEADER ASSY, TIN CONTACTS W/PCB POLARIZATION FEATURE, SINGLE ROW,MICRO MATE-N-LOK
|
Tyco Electronics
|
| 0440671403 44067-1403 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector
|
Molex Electronics Ltd.
|
| NJU6636 |
16-CHARACTER 2-LINE DOT MATRIX LCD CONTROLLER DRIVER with Icon Display
From old datasheet system
|
New Japan Radio
|
|
