| PART |
Description |
Maker |
| HDSP-076 HDSP-0760 HDSP-0761 HDSP-0762 HDSP-0773 H |
Hexadecimal and Numeric Displays for Industrial Applications 十六进制数字显示和工业应
16-Bit Buffer/Line Driver with 3-STATE Outputs; Package: TSSOP; No of Pins: 48; Container: Rail
16-Bit Buffer/Line Driver with 3-STATE Outputs; Package: TSSOP; No of Pins: 48; Container: Tape & Reel
HDSP-0961 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0761 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0762 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0772 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0760 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0770 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0771 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0763 · Numeric DIsplays for Industrial Applications
HDSP-0960 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0962 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0963 · Numeric DIsplays for Industrial Applications
HDSP-0860 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0861 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0862 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0863 · Numeric DIsplays for Industrial Applications
|
Avago Technologies, Ltd.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
| 5962L9960701QUA 5962L9960701QUC 5962L9960701QUX 59 |
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 5E4(50krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si)
512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)
512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish factory option. Extended industrial temperature range flow.
512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si)
512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish gold. Extended industrial temperature range flow.
512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish gold. Extended industrial temperature range flow.
512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 1E4(10krad)(Si)
512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si)
|
Aeroflex Circuit Technology
|
| R191-094-000 |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| 1456RK4 1456RK4BKBU 1456RK4WHBU |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| R191-172-000 |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| R190-150-000 |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| R191-054-000 |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| R190-112-000 |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| R190-110-000 |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| R191-152-000 |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| R191-092-000 |
Enclosures can be Factory Modified ( Milling, Drilling, Printing etc. )
|
Hammond Manufacturing L...
|
| TLP3100 |
Measurement Equipment FA (Factory Automation) Power Line Control
|
Toshiba Semiconductor
|
