| PART |
Description |
Maker |
| AN483 |
MIXED WIRE BONDING TECHNOLOGY FOR AUTOMOTIVE SMART POWER ICs
|
SGS Thomson Microelectronics
|
| 1344171 8663 8663000250 866300050 |
Shielding and Bonding Cable.
|
List of Unclassifed Man...
|
| 35181-0210 351810210 |
1.78mm (.070) Tab Multiple Wire-to-Wire Female Housing, 2 Circuits, Vertical, B-Type
|
Molex Electronics Ltd.
|
| 35528-1300 0355281300 |
2.50mm (.098) Pitch Wire-to-Wire Male Housing with Mounting Ear, Positive Locking, Vertical, 13 Circuits
|
Molex Electronics Ltd.
|
| S8650 |
Si PIN photodiode Flat surface ideal for bonding to scintillator
|
Hamamatsu Corporation
|
| 0359790640 35979-0640 |
7.92mm (.312) Pitch Wire-to-Board Header, Vertical, 6 Circuits, White, Short PC Tails, Polyester Alloy, Glow Wire Compatible
|
http://
Molex Electronics Ltd.
|
| 35127-0400 0351270400 |
6.00mm (.236") Pitch Wire-to-Wire Male Housing, 4 Circuits, Vertical
6.00mm (.236) Pitch Wire-to-Wire Male Housing, 4 Circuits, Vertical
|
Molex Electronics Ltd.
|
| 35965-0200 0359650200 |
1.78mm (.070") Tab Multiple Wire-to-Wire Female Housing, 2 Circuits, Vertical, A-Type
1.78mm (.070) Tab Multiple Wire-to-Wire Female Housing, 2 Circuits, Vertical, A-Type
|
Molex Electronics Ltd.
|
| TAB-35006 |
Tape Carrier Package/Tape Automated Bonding (TCP/TAB)
|
Yamaichi Electronics
|
| BCM7402 BCM3252 BCM3252KPBG |
DUAL-CHANNEL FRONT-END DOCSIS 2.0 STB IC WITH CHANNEL BONDING
|
Broadcom Corporation.
|
| DF24A-40DP-0.9C DF24A-40DP-0.9V DF24A50DS-0.9V DF2 |
0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
|
Hirose Electric
|
| 0038000611 A-6410-5A-3 38-00-0611 |
2.54mm (.100) Pitch KK? Wire-to-Board Header, Vertical Square Pin, 5 Circuits, Circuit 3 Voided
2.54mm (.100") Pitch KK垄莽 Wire-to-Board Header, Vertical Square Pin, 5 Circuits, Circuit 3 Voided
MOLEX Connector
|
Molex Electronics Ltd.
|
