| PART |
Description |
Maker |
| FL9B5BH030S-C FL9B5BH060S-C FL7B5BH FL9B5BH033S-C |
Ball-Grid-Array Thin Film Low-Pass Filter
|
ETC
List of Unclassifed Manufacturers
|
| ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| RFP-20-50TPP-S |
0 MHz - 2000 MHz 50 ohm RF/MICROWAVE TERMINATION ROHS COMPLIANT, CERAMIC PACKAGE-1
Flangeless Termination 20 Watts, 50
|
Anaren, Inc.
Anaren Microwave
|
| GCJ21BL81H104KA01 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| GCJ21BC72A105KE02 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| GRJ21AR72E152KWJ1 |
Chip Monolithic Ceramic Capacitor Soft Termination Type
|
Murata Manufacturing Co...
|
| GCJ188R92A333KA01 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| YPKG-BCCG-9287DC |
CCGA1152, 35.0 MM X 35.0 MM, 1.0 MM PITCH, 1152 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
| AY-3-8500 |
Ball and Paddle
|
General Semiconductor
|
