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19-3008; Rev 0; 10/03
2x MAX3701
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MAX3701 DVD MAX3701 RF
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0.9ns 200mA H (1nA/Hz) /
RF
/ (OPC) 200mA 200mAP-P 400Mbps MAX3701 CMOS RF 5 5mm2 32 200MHz QFN 600MHz

200MHz CMOS
600MHz
CMOS/TTL
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2x DVD
____________________________
PART TEMP RANGE 0C to +70C PIN-PACKAGE 32 Thin QFN MAX3701CTJ
1x
DVD
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FREQ VCC GND VCCO AMP GND EN RWB
TOP VIEW
32
GND D5 GND D4 INREF D3 GND D2
31
30
29
28
27
26
25 24 23 22 21
VCCO GND OUT OUT VCC MDIN SEL SCLK
1 2 3 4 5 6 7 8 9
GND
MAX3701
20 19 18 17
10
V5
11
V4
12
V3
13
V2
14
V1
15
VCC
16
MDOUT
THIN QFN*
*EXPOSED PAD
________________________________________________________________ Maxim Integrated Products
1
Maxim
Maxim Maxim
Maxim
www.maxim-ic.com.cn
2x MAX3701
ABSOLUTE MAXIMUM RATINGS
Supply Voltage VCC ..............................................-0.5V to +6.0V Supply Voltage VCCO ..........................................-0.5V to +10.0V Voltage at RWB, EN, SEL, FREQ, AMP, D2, D3, D4, D5, V1, V2, V3, V4, V5 .........-0.5V to (VCC + 0.5V) Voltage at OUT ......................................................-0.5V to VCCO Current from OUT............................................-20mA to +400mA Continuous Power Dissipation (TA = +70C) 32-Pin Thin QFN (derate 23.3mWC above +70C) ...1860.5mW Operating Junction Temperature Range (TJ) ....-55C to +150C Storage Ambient Temperature Range (Ts) .......-55C to +150C Lead Solder Temperature (10s).......................................+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +4.5V to +5.5V, VCCO = +8.5V to +9.5V, TA = 0C to +70C. Typical values are at VCC = +5.0V, VCCO = +9.0V, IOUT = 100mA, TA = +25C, unless otherwise noted.)
PARAMETER POWER SUPPLY (ICC, ICCO) Power-Supply Voltage Power-Supply Current Power-Supply Off-Current VCC VCCO ICC ICCO ICC ICCO VINREF +4.5 (Note 1) Exclude laser current and current set by V2, V3, V4, and V5 EN = low +8.5 +5.0 +9.0 28 +5.5 +9.5 55 31 3 3 3.0 VINREF x 0.8 VINREF x 0.2 16 Measured with respect to GND (Note 4) 9 0 3.0 67 3.3 74 3.6 82 5 -4 Per channel sourcing (Note 4) Total output sourcing Set by RAMP (Notes 5, 6) (Notes 5, 6) Set by RFREQ (Note 6) 200 15 200 15 150 10 600 +4 19 3.3 3.6 V mA mA SYMBOL CONDITIONS MIN TYP MAX UNITS
HIGH-SPEED SIGNAL INPUT (D2, D3, D4, D5) Input Voltage Reference Input High Voltage Input Low Voltage Input Impedance CHANNEL VOLTAGE SET (V1, V2, V3, V4, V5) (NOTE 3) Input Resistance Minimum Input Voltage Maximum Input Voltage Voltage-to-Current Gain Voltage-to-Current Gain Nonlinearity Output Offset Current Maximum Output Current Minimum Output Current RF OSCILLATOR Output Current Swing Set Range Output Current Swing Set Accuracy Oscillation Frequency Set Range mAP-P % MHz k V V mA/V % mA mA mA For write (Note 2) (Note 2) V V V k
2
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2x
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +4.5V to +5.5V, VCCO = +8.5V to +9.5V, TA = 0C to +70C. Typical values are at VCC = +5.0V, VCCO = +9.0V, IOUT = 100mA, TA = +25C, unless otherwise noted.)
PARAMETER Oscillator Frequency Set Accuracy Oscillator Temperature Coefficient Output Off-Current OUTPUT AND GENERAL SPECIFICATIONS Maximum Output Set Current Minimum Output Set Current Output Off-Current Write Rise-Time Write Fall-Time Output Overshoot Output-Current Noise Input Propagation Delay Enable Propagation Delay Disable Propagation Delay MDIN Current Range MDIN Voltage MDIN Capacitance Equivalent MDIN Bandwidth Equivalent Transimpedance Acquisition Rate MDOUT Stability MDOUT Droop Rate MDOUT DC Offset MDOUT Voltage MDOUT Voltage Resolution MDOUT Resistance IMDIN to VMDOUT Accuracy SCLK to MDOUT Delay CONTROL SIGNAL (EN, RWB, SEL, SCLK) TTL Input High Voltage TTL Input Low Voltage CMOS Input High Voltage Applies to SEL and SCLK Applies to SEL and SCLK Applies to EN and RWB VINREF x 0.8 +2.0 +0.8 V V V (Note 5) VMDOUT CMDIN BWMDIN ZF SCLK (Note 11) SEL = low SEL = high Triggered on rising edge Relative to IMDIN (Note 12) Discrete time sample and hold Zero level IMDIN = 600A, SEL = low (including DC offset) 0.26 0 0.30 1.3 3.9 3 5 100 0.34 1.5 250 tPROP tON tOFF IMDIN IMDIN = 600A tr tf IOUT IOUT EN = Low Measured from 10% to 90% (Notes 5, 7) Measured from 10% to 90% (Notes 5, 7) (Notes 7, 8) (Notes 5, 9, condition i.) (Notes 5, 9, condition ii.) At D2, D3, D4, D5. (Notes 5, 10) At EN, RWB (Notes 5, 7, 9, 10) At EN, RWB (Notes 5, 7, 9, 10) 10 1.6 0.5 500 1.667 10.0 1 5 0.85 0.95 8 1.0 1.5 2.0 2.0 3.0 4.0 150 150 600 2.0 200 15 1 0.9 1.0 mA mA mA ns ns % nA/Hz ns ns ns A V pF kHz k MHz % V/s V V mVpk k % ns RWB = low (Note 5) SYMBOL CONDITIONS Measured at +25C -150 0.1 MIN TYP MAX 10 UNITS % ppm/C mAP-P
MAX3701
MONITOR DIODE INPUT AND SAMPLE-AND-HOLD SPECIFICATIONS
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3
2x MAX3701
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +4.5V to +5.5V, VCCO = +8.5V to +9.5V, TA = 0C to +70C. Typical values are at VCC = +5.0V, VCCO = +9.0V, IOUT = 100mA, TA = +25C, unless otherwise noted.)
PARAMETER CMOS Input Low Voltage Control Input Current SYMBOL CONDITIONS Applies to EN and RWB At high voltage At low voltage -50 MIN TYP MAX VINREF x 0.2 +50 UNITS V A
Note 1: Note 2: Note 3: Note 4:
VCCO should be selected to keep a minimum headroom of 3.0V for the driver output, OUT. The input pulse width has to be sufficient to achieve the desired output performance. Operating frequency of the set inputs (V1, V2, V3, V4, V5) is 1MHz. Conditions are that no single channel can be programmed beyond the maximum output level. Also, all five channels must _ be programmed so their total output current (I1 + I2 + I3 + I4 + I5) is below the maximum output level. It is important that __ this condition is assumed even for those channels not being used (i.e., those channels with inactive data signal). Note 5: AC characteristics are guaranteed by design and characterization. Note 6: Read oscillator is bandwidth limited, -3dB at approximately 400MHz (see the Typical Operating Characteristics). Note 7: IDC = 50mA and IAC = 50mAP-P.
Z0 = 50 DUT L = 20mm 10 5pF
2
1.3nH
5pF
18pF
17.5
SIMPLIFIED LASER MODEL
1 Note 8: A compensation network to match the laser diode is required to achieve the overshoot specifications, otherwise the overshoot can be significantly higher. (See Figure 1.) Note 9: Output Current Noise to be measured from 10MHz to 30MHz at two separate conditions for IOUT: i. IDC = 45mA and IAC = 40mAP-P (oscillator = 400MHz) ii. IDC = 50mA and IAC = 70mAP-P (oscillator = 400MHz)
400MHz IAC IDC
2
4
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2x
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +4.5V to +5.5V, VCCO = +8.5V to +9.5V, TA = 0C to +70C. Typical values are at VCC = +5.0V, VCCO = +9.0V, IOUT = 100mA, TA = +25C, unless otherwise noted.) Note 10: __________________________________________________________________________________________________See Figure 3.
MAX3701
OUT tON EN
tON tPROP
tPROP
tPROP
tOFF
tOFF RWB
V1
D2
D3 TO D5 NOTE: EDGE SPEEDS ARE NOT TO SCALE. (tON/tOFF >> tPROP)
3 Note 11: Capable of tracking input changes up to 150AP-P at 250kHz (with SEL set low). Note 12: Assumes total tracking of output signal error relative to IMD at +25C and VCC = +5.0V.
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(VCC = +5.0V, VCCO = +9.0V, TA = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. TEMPERATURE
MAX3701 toc01
VOLTAGE SET vs. OUTPUT CURRENT
FOR V1 THROUGH V5 2.5 INPUT VOLTAGE (V) 2.0 1.5 1.0 0.5 0
MAX3701 toc02
OSCILLATOR FREQUENCY vs. FREQUENCY-SET RESISTOR
MAX3701 toc03
35 30 25 VCC (mA) 20 15 10 5 -10 5 20 35 50 65
3.0
600 OSCILLATOR FREQUENCY (MHz) 525 450 375 300 225 150
80
0
20 40 60 80 100 120 140 160 180 200 OUTPUT CURRENT (mA)
1.50
2.25
3.00
3.75 RFREQ (k)
4.50
5.25
6.00
TEMPERATURE (C)
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5
2x MAX3701
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(VCC = +5.0V, VCCO = +9.0V, TA = +25C, unless otherwise noted.)
OSCILLATOR CURRENT AMPLITUDE vs. AMPLITUDE SET RESISTOR
MAX3701 toc04
(
)
OSCILLATOR FREQUENCY vs. TEMPERATURE
-200ppm/C OSCILLATOR FREQUENCY (MHz) 420
MAX3701 toc05
160 140 OUTPUT CURRENT (mAP-P) 120 100 80 60 40 20 0 0 2 4 6 RAMP (k) 8 10 400MHz 200MHz
440
400
380
360
340 12 -10 5 20 35 50 65 80 TEMPERATURE (C)
ELECTRICAL OUTPUT WAVEFORM (IDC = 50mA AND IAC = 50mAP-P)
OPTICAL OUTPUT WAVEFORM (USING NICHIA 408nm LASER DIODE)
MAX3701 toc07
MAX3701 toc06
2x RATE 300Mbps
70mV/div
10mV/div
REFER TO APPLICATION NOTE HFDN28.0 FOR DETAILS 3ns/div 3.0ns/div
OUTPUT NOISE vs. NOISE FREQUENCY
MAX3701 toc08
SAMPLE AND HOLD OUTPUT vs. MONITOR-DIODE INPUT CURRENT
SEL = HIGH (MDOUT) SAMPLE-AND-HOLD VOLTAGE (mV) 1200 1000 800 600 400 200
MAX3701 toc09
3.00 2.50 OUTPUT NOISE (A/Hz) 2.00 1.50 1.00 0.50 0 5 10 15 20 25 30 35 MEASURED AT 400MHz OUTPUT WITH 45mA BIAS AND 40mAP-P AMPLITUDE
1400
40
0
20
40
60 MDIN (A)
80
100
120
NOISE FREQUENCY (MHz)
6
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2x MAX3701
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(VCC = +5.0V, VCCO = +9.0V, TA = +25C, unless otherwise noted.)
RF OUTPUT AMPLITUDE vs. OSCILLATOR FREQUENCY
MAX3701 toc10
(
)
OPTICAL OUTPUT WAVEFORM (USING NICHIA 408nm LASER DIODE)
MAX3701 toc11
70 60 OUTPUT AMPLITUDE (mAP-P) 50 40
1x RATE 500Mbps
10mV/div 30 20 10 0 200 250 300 350 400 450 500 550 600 OSCILLATOR FREQUENCY (MHz) REFER TO APPLICATION NOTE HFDN28.0 FOR DETAILS 1.5ns/div
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1, 3, 7, 9, 23, 26, 30 2 4 5 6 8 10 11 12 13 14 15, 20, 29 16 17 18 19
GND D5 D4 INREF D3 D2 V5 V4 V3 V2 V1
CC
5 4
CMOS CMOS D2 +3.3V D5 EN RWB
3 2 5 4 3 2 1
CMOS CMOS 5 4 3 2 (IBIAS) +5.0V 1 (IBIAS)
MDOUT SCLK SEL MDIN
/ CMOS/TTL CMOS/TTL SEL / SEL 10k / 7 1.667k
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2x MAX3701
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PIN 21, 22 24, 25 27 28 31 32 -- NAME OUT VCCO RWB EN FREQ AMP EP
()
+9V CMOS R/W 2 CMOS RF RF IC RF RF 5 2 5
_________________________________________________________________________
+5V SCLK MD
MONITOR DIODE
INREF
SAMPLE AND HOLD
MDOUT
SEL
OUTPUT DRIVER OUT
AMP RAMP RFREQ RWB RF CHANNEL FREQ MAX3701 LASER DIODE
EN
D5
V5
D4
V4
D3
V3
D2
V2
V1
8
_______________________________________________________________________________________
2x MAX3701
____________________________
MAX3701 MAX370 RF DVD MAX3701 RF OPC / 200mA
/
MAX3701 V1 1.667k EN 10 k MDOUT MAX3701 / SEL SEL 1MHz SEL
MAX3701 (RWB (V2 V3 D5) CMOS RWB EN ) V4 V5) (D2 D3 D4
_______________________________________
MAX3701 50 RC
RF
MAX3701 (RFREQ) ( ) RWB (RAMP)
MAX3701 HFDN2-8.0:Interfacing the MAX3701 to a Blue/ / ) Violet Laser Diode (MAX3701 HFAN02.0:Interfacing Maxim's Laser Divers to Laser Diodes (Maxim )
RWB 1 5
MAX3701 RF 5
1 V1 V5
1
OPERATION MAX3701 Disabled Read Mode Write Mode Transimpedance Gain (1.667k) Transimpedance Gain (10.0k) EN 0 1 1 1 1 RWB X 1 0 X X SEL X X X 0 1
2
D2
D5 200mA
200mA
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9
2x MAX3701
_____________________________________________________________
+5.0V +9.0V
RWB
SCLK
SEL
CONTROL CIRCUITRY
EN
INREF D2 D3 D4 D5 V1 V2 V3 V4 V5 FREQ
VCC
VCCO Z0 = 50 OUTOUT+ L = 20mm RSHUNT CCOMP RDAMP
VOLTAGE DAC
MAX3701
CSHUNT +5.0V
MDIN AMP GND MDOUT
ADC FOR OPC RFREQ
RAMP
____________________________
MAX3701 V1 FREQ AMP 15mA
fOUT = 1 15 x10-12 + 815 x10-15 (RFREQ + 50)
RWB
TRANSISTOR COUNT: 2399 PROCESS: Bipolar SUBSTRATE: Ground
IOUTP -P = 1+ 3 x10-6 RAMP - 3 x103
(
)R
262 at 200MHz AMP + 50
10
______________________________________________________________________________________
2x MAX3701
___________________________________________________________________
( www.maxim-ic.com/packages )
0.15 C A
D2
C L
D
b D2/2
0.10 M C A B
PIN # 1 I.D.
D/2
0.15 C B
k
PIN # 1 I.D. 0.35x45
E/2 E2/2 E (NE-1) X e
C L
E2
k L
DETAIL A
e (ND-1) X e
C L
C L
L e 0.10 C A 0.08 C e
L
C
A1 A3
PROPRIETARY INFORMATION TITLE:
PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
DOCUMENT CONTROL NO. REV.
APPROVAL
21-0140
C
1 2
______________________________________________________________________________________
11
QFN THIN.EPS
2x MAX3701
_______________________________________________________________
( www.maxim-ic.com/packages )
(
)
COMMON DIMENSIONS
EXPOSED PAD VARIATIONS
NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220. 10. WARPAGE SHALL NOT EXCEED 0.10 mm.
PROPRIETARY INFORMATION TITLE:
PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
DOCUMENT CONTROL NO. REV.
APPROVAL
21-0140
C
2 2
MAXIM
8328 800 810 0310 010-6201 0598 010-6201 0298 100083
Maxim
Maxim
Maxim
12 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600 (c) 2003 Maxim Integrated Products Printed USA
Maxim Integrated Products, Inc.

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