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PRELIMINARY DATA SHEET
BIPOLAR DIGITAL INTEGRATED CIRCUIT
PB1511TB
800 MHz INPUT DIVIDE BY 2, 4 PRESCALER IC FOR PORTABLE SYSTEMS
The PB1511TB is a silicon monolithic integrated circuit designed as a divide by 2, 4 prescaler IC for portable radio systems. This IC is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. Consequently, this IC is lower circuit current and smaller package than conventional PB1509GV.
FEATURES
* Operating frequency * Low current consumption * High-density surface mounting * Supply voltage * Selectable division : fin = 50 to 700 MHz @ / 2, 50 to 800 MHz @ / 4 : 3.5 mA @ VCC = 3.0 V : 6-pin super minimold : VCC = 2.4 to 3.3 V : / 2, / 4
APPLICATIONS
* Portable radio systems * Cellular/cordless telephone 2nd local prescaler
ORDERING INFORMATION
Part Number Package 6-pin super minimold Marking C2Z Supplying Form Embossed tape 8 mm wide. Pin 1, 2, 3 face the tape perforation side. Qty 3 kpcs/reel.
PB1511TB-E3
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
PB1511TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P14731EJ1V0DS00 (1st edition) Date Published June 2000 N CP(K) Printed in Japan
(c)
2000
PB1511TB
PIN CONNECTIONS
Pin No.
(Top View) 3 2 1 (Bottom View) 4 5 6 4 5 6 3 2 1
Pin Name OUT GND SW IN IN VCC
1 2
C2Z
3 4 5 6
PRODUCT LINE-UP
Part Number ICC (mA) 5.0 3.5 VCC (V) 2.2 to 5.5 2.4 to 3.3 /2 fin (MHz) 50 to 700 50 to 700 /4 fin (MHz) 50 to 800 50 to 800 /8 fin (MHz) 50 to 1 000 - Package 8-pin SSOP 6-pin super minimold
PB1509 GV PB1511TB
Remark
This table shows the TYP. values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS.
INTERNAL BLOCK DIAGRAM
D IN IN CLK
Q
D CLK
Q OUT Q
Q
SW
2
Preliminary Data Sheet P14731EJ1V0DS00
PB1511TB
SYSTEM APPLICATION EXAMPLE
One of the example for usage
Low Noise Tr. RX DEMOD. I Q
VCO VCO SW /N /N PLL PLL
PB1511TB
I
0 TX PA Phase Shifter 90
Q
Quadulator Modulator
This block diagram schematically shows the PB1511TB's location in one of the example application system. The other applications are also acceptable for divider use.
Preliminary Data Sheet P14731EJ1V0DS00
3
PB1511TB
PIN EXPLANATIONS
Applied Voltage (V)
Pin No.
Symbol
Functions and Explanation
1
OUT
Divided frequency output pin. This pin is designed as emitter follower output. This pin can output 0.2 VP-P MIN. with 200 load. This pin should be coupled to load device with capacitor (example: 1 000 pF) for DC cut. Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. Divide ratio control pin. Divide ratio can be determined by following applied level to these pins. SW H Divide ratio 1/2 L 1/4
2
GND
0
3
SW
H/L
These pins must be each equipped with bypass capacitor to minimize their impedance. 4 IN Signal input pin. This pin should be coupled to signal source with capacitor (example: 1 000 pF) for DC cut. Signal input bypass pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. Power supply pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance.
5
IN
6
VCC
2.4 to 3.3
4
Preliminary Data Sheet P14731EJ1V0DS00
PB1511TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Input Voltage Total Power Dissipation Symbol VCC Vin PD TA = +25C TA = +25C, SW pin Mounted on double sided copper clad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C) Conditions Ratings 3.6 3.6 200 Unit V V mW
Operating Ambient Temperature Storage Temperature
TA Tstg
-40 to +85 -55 to +150
C C
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 2.4 -40 TYP. 3.0 +25 MAX. 3.3 +85 Unit V C
ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 3.0 V)
Parameter Circuit Current Upper Limit Operating Frequency 1 Upper Limit Operating Frequency 2 Symbol ICC fin(U)1 fin(U)2 Test Conditions No signals Pin = -20 to 0 dBm Pin = -20 to -5 dBm @ / 2 @/4 Pin = -20 to 0 dBm Pin = -20 to -5 dBm fin = 50 to 800 MHz fin = 50 to 500 MHz RL = 200 MIN. 3.1 500 700 800 -20 -20 0.2 0.7 x VCC -0.5 TYP. 3.5 0.3 MAX. 4.1 50 500 -5 0 VCC + 0.5 VCC x 0.3 Unit mA MHz MHz
Lower Limit Operating Frequency 1 Lower Limit Operating Frequency 2 Input Power 1 Input Power 2 Output Voltage Divide Ratio Control Input High Divide Ratio Control Input Low
fin(L)1 fin(L)2 Pin1 Pin2 Vout VIH VIL
MHz MHz dBm dBm VP-P V V
Preliminary Data Sheet P14731EJ1V0DS00
5
PB1511TB
TEST CIRCUIT
1 000 pF 3 SW 2 GND 1 OUT 1 000 pF 150 IN IN VCC 4 1 000 pF High Impedance Oscilloscope 5 6 1 000 pF 50 Signal Generator
1 000 pF
50 Counter (or Spectrum Analyzer) Power Supply
Divide Ratio Setting
SW H L 1/2 1/4
PACKAGE DIMENSIONS
6-pin super minimold (Unit: mm)
2.10.1 1.250.1
2.00.2
1.3
0.65
0.65
0.1 MIN.
0.90.1
0.7
6
Preliminary Data Sheet P14731EJ1V0DS00
0 to 0.1
0.15+0.1 -0
0.2+0.1 -0.05
PB1511TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). Keep the track length of the ground pins as short as possible. (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit: None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Preliminary Data Sheet P14731EJ1V0DS00
7
PB1511TB
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
* The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

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