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HGTP5N120CN, HGT1S5N120CNS
Data Sheet January 2000 File Number 4596.2
25A, 1200V, NPT Series N-Channel IGBT
The HGTP5N120CN and HGT1S5N120CNS are Non-Punch Through (NPT) IGBT designs. They are new members of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors. Formerly Developmental Type TA49309.
Features
* 25A, 1200V, TC = 25oC * 1200V Switching SOA Capability * Typical Fall Time. . . . . . . . . . . . . . . . 350ns at TJ = 150oC * Short Circuit Rating * Low Conduction Loss * Avalanche Rated * Temperature Compensating SABERTM Model Thermal Impedance SPICE Model www.intersil.com * Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
Ordering Information
PART NUMBER HGTP5N120CN HGT1S5N120CNS PACKAGE TO-220AB TO-263AB BRAND G5N120CN
Packaging
JEDEC TO-220AB ALTERNATE VERSION
E C
G5N120CN
G
NOTE: When ordering, use the entire part number. Add the suffix 9A to obtain the TO-263AB variant in Tape and Reel, i.e., HGT1S5N120CNS9A.
COLLECTOR (FLANGE)
Symbol
C
JEDEC TO-263AB
G COLLECTOR (FLANGE) E G E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS 4,364,073 4,598,461 4,682,195 4,803,533 4,888,627 4,417,385 4,605,948 4,684,413 4,809,045 4,890,143 4,430,792 4,620,211 4,694,313 4,809,047 4,901,127 4,443,931 4,631,564 4,717,679 4,810,665 4,904,609 4,466,176 4,639,754 4,743,952 4,823,176 4,933,740 4,516,143 4,639,762 4,783,690 4,837,606 4,963,951 4,532,534 4,641,162 4,794,432 4,860,080 4,969,027 4,587,713 4,644,637 4,801,986 4,883,767
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 2000 SABERTM is a trademark of Analogy, Inc.
HGTP5N120CN, HGT1S5N120CNS
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified HGTP5N120CN HGT1S5N120CNS Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BVCES Collector Current Continuous At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC110 Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM Switching Safe Operating Area at TJ = 150oC, Figure 2 . . . . . . . . . . . . . . . . . . . . . . . . SSOA Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Forward Voltage Avalanche Energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAV Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Lead Temperature for Soldering Leads at 0.063in (1.6mm) from case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, see Tech Brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC Short Circuit Withstand Time (Note 2) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC 1200 25 12 40 20 30 30A at 1200V 167 1.33 36 -55 to 150 300 260 8 15 UNITS V A A A V V W W/oC mJ oC
oC oC
s s
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) = 840V, TJ = 125oC, RG = 25.
Electrical Specifications
PARAMETER
TC = 25oC, Unless Otherwise Specified SYMBOL BVCES BVECS ICES TEST CONDITIONS IC = 250A, VGE = 0V IC = 10mA, VGE = 0V VCE = BVCES TC = 25oC TC = 125oC TC = 150oC MIN 1200 15 6.0 25 TYP 100 2.1 2.9 7.0 MAX 250 2 2.4 3.5 250 UNITS V V A A mA V V V nA A
Collector to Emitter Breakdown Voltage Emitter to Collector Breakdown Voltage Collector to Emitter Leakage Current
Collector to Emitter Saturation Voltage
VCE(SAT)
IC = 5.5A, VGE = 15V
TC = 25oC TC = 150oC
Gate to Emitter Threshold Voltage Gate to Emitter Leakage Current Switching SOA
VGE(TH) IGES SSOA
IC = 45A, VCE = VGE VGE = 20V TJ = 150oC, RG = 25, VGE = 15V, L = 200H, VCE(PK) = 1200V IC = 5.5A, VCE = 0.5 BVCES IC = 5.5A, VCE = 0.5 BVCES VGE = 15V VGE = 20V
Gate to Emitter Plateau Voltage On-State Gate Charge
VGEP QG(ON)
-
10.6 45 60
55 75
V nC nC
2
HGTP5N120CN, HGT1S5N120CNS
Electrical Specifications
PARAMETER Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time Turn-On Energy (Note 3) Turn-On Energy (Note 3) Turn-Off Energy (Note 4) Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time Turn-On Energy (Note 3) Turn-On Energy (Note 3) Turn-Off Energy (Note 4) Thermal Resistance Junction To Case NOTES: 3. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. EON1 is the turn-on loss of the IGBT only. EON2 is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in Figure 18. 4. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. TC = 25oC, Unless Otherwise Specified (Continued) SYMBOL td(ON)I trI td(OFF)I tfI EON1 EON2 EOFF td(ON)I trI td(OFF)I tfI EON1 EON2 EOFF RJC IGBT and Diode at TJ = 150oC ICE = 5.5A VCE = 0.8 BVCES VGE = 15V RG = 25 L = 5mH Test Circuit (Figure 18) TEST CONDITIONS IGBT and Diode at TJ = 25oC ICE = 5.5A VCE = 0.8 BVCES VGE = 15V RG = 25 L = 5mH Test Circuit (Figure 18) MIN TYP 22 12 180 280 220 400 640 20 12 225 350 220 1 1 MAX 30 16 250 350 500 700 25 16 300 400 1.2 1.1 0.75 UNITS ns ns ns ns J J J ns ns ns ns J mJ mJ
oC/W
Typical Performance Curves
25 ICE , DC COLLECTOR CURRENT (A)
Unless Otherwise Specified
ICE , COLLECTOR TO EMITTER CURRENT (A) 35 30 25 20 15 10 5 0
VGE = 15V
TJ = 150oC, RG = 25, VGE = 15V, L = 200H
20
15
10
5
0
25
50
75
100
125
150
0
200
400
600
800
1000
1200
1400
TC , CASE TEMPERATURE (oC)
VCE , COLLECTOR TO EMITTER VOLTAGE (V)
FIGURE 1. DC COLLECTOR CURRENT vs CASE TEMPERATURE
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
3
HGTP5N120CN, HGT1S5N120CNS Typical Performance Curves
fMAX , OPERATING FREQUENCY (kHz) 200
Unless Otherwise Specified (Continued)
tSC , SHORT CIRCUIT WITHSTAND TIME (s)
TJ = 150oC, RG = 25, L = 5mH, V CE = 960V
TC 75oC 75oC 110oC 110oC
VGE 15V 12V 15V 12V
35
VCE = 840V, RG = 25, TJ = 125oC
100
30
60 ISC 50
50
25
TC = 75oC, VGE = 5V IDEAL DIODE fMAX1 = 0.05 / (td(OFF)I + td(ON)I) fMAX2 = (PD - PC) / (EON2 + EOFF) PC = CONDUCTION DISSIPATION (DUTY FACTOR = 50%) ROJC = 0.75oC/W, SEE NOTES 1 2 3 5 10
20
40
20
15 tSC 10 10
30
10
11
12
13
14
15
20
ICE , COLLECTOR TO EMITTER CURRENT (A)
VGE , GATE TO EMITTER VOLTAGE (V)
FIGURE 3. OPERATING FREQUENCY vs COLLECTOR TO EMITTER CURRENT
FIGURE 4. SHORT CIRCUIT WITHSTAND TIME
ICE, COLLECTOR TO EMITTER CURRENT (A)
ICE , COLLECTOR TO EMITTER CURRENT (A)
35 30 25 20 15
80 70 60 50 40 30 20 10 0 0 2 4 6 TC = 25oC TC = -55oC TC = 150oC DUTY CYCLE < 0.5%, VGE = 15V 250s PULSE TEST
DUTY CYCLE < 0.5%, VGE = 12V 250s PULSE TEST
TC = -55oC
TC = 150oC
TC = 25oC 10 5 0
0
1
2
3
4
5
6
7
8
9
10
8
VCE , COLLECTOR TO EMITTER VOLTAGE (V)
VCE , COLLECTOR TO EMITTER VOLTAGE (V)
FIGURE 5. COLLECTOR TO EMITTER ON-STATE VOLTAGE
FIGURE 6. COLLECTOR TO EMITTER ON-STATE VOLTAGE
3000 EON2 , TURN-ON ENERGY LOSS (mJ) RG = 25, L = 5mH, VCE = 960V 2500 TJ = 150o, VGE = 15V, VGE = 12V 2000 1500 1000 500 TJ = 25oC, VGE = 15V, VGE = 12V 0 2 3 4 5 6 7 8 9 10 ICE , COLLECTOR TO EMITTER CURRENT (A) EOFF, TURN-OFF ENERGY LOSS (J)
1750 RG = 25, L = 5mH, VCE = 960V 1500 TJ = 150oC, VGE = 12V OR 15V 1250 1000 750 500 TJ = 25oC, VGE = 12V OR 15V 250 0
1
2
3
4
5
6
7
8
9
ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 7. TURN-ON ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT
FIGURE 8. TURN-OFF ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT
4
ISC , PEAK SHORT CIRCUIT CURRENT (A) 10 10
70
HGTP5N120CN, HGT1S5N120CNS Typical Performance Curves
40
tdI , TURN-ON DELAY TIME (ns) RG = 25, L = 5mH, VCE = 960V
Unless Otherwise Specified (Continued)
40 35
RG = 25, L = 5mH, VCE = 960V
35
trI , RISE TIME (ns)
30 25 20 15 10 0
TJ = 25oC, TJ = 150oC, VGE = 12V
30
TJ = 25oC, TJ = 150oC, VGE = 12V
25
20 TJ = 25oC, TJ = 150oC, VGE = 15V 15 2 3 4 5 6 7 8 9 10
TJ = 25oC, TJ = 150oC, VGE = 15V 2 3 4 5 6 7 8 9 10
ICE , COLLECTOR TO EMITTER CURRENT (A)
ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 9. TURN-ON DELAY TIME vs COLLECTOR TO EMITTER CURRENT
FIGURE 10. TURN-ON RISE TIME vs COLLECTOR TO EMITTER CURRENT
600 td(OFF)I , TURN-OFF DELAY TIME (ns) 500
RG = 25, L = 5mH, VCE = 960V
900 RG = 25, L = 5mH, VCE = 960V 800 tfI , FALL TIME (ns) 700 600 500 400 300 TJ = 25oC, VGE = 12V AND 15V TJ = 150oC, VGE = 12V AND 15V
400 300 200 100 TJ = 25oC, VGE = 12V, VGE = 15V 0 1 2 3 4 5 6 7 8 9 10 TJ = 150oC, VGE = 12V, VGE = 15V
200 100 1 2 3 4 5 6 7 8 9 10
ICE , COLLECTOR TO EMITTER CURRENT (A)
ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 11. TURN-OFF DELAY TIME vs COLLECTOR TO EMITTER CURRENT
FIGURE 12. FALL TIME vs COLLECTOR TO EMITTER CURRENT
ICE, COLLECTOR TO EMITTER CURRENT (A)
90 80 70 60 50 40 30 20 10 0 6
DUTY CYCLE < 0.5%, VCE = 20V 250s PULSE TEST
TC = 25oC
VGE , GATE TO EMITTER VOLTAGE (V)
100
16 14 12 10 8 6 4 2 0
7 8 9 10 11 12 13 14 15 16 VCE = 400V VCE = 800V
VCE = 1200V
TC = -55oC
TC = 150oC
IG(REF) = 1mA, RL = 120, TC = 25oC 0 10 20 30 40 50 60
VGE , GATE TO EMITTER VOLTAGE (V)
QG , GATE CHARGE (nC)
FIGURE 13. TRANSFER CHARACTERISTIC
FIGURE 14. GATE CHARGE WAVEFORMS
5
HGTP5N120CN, HGT1S5N120CNS Typical Performance Curves
2.0
FREQUENCY = 1MHz
Unless Otherwise Specified (Continued)
ICE , COLLECTOR TO EMITTER CURRENT (A)
7 6 5 4 3 2 1 0
C, CAPACITANCE (nF)
1.5
DUTY CYCLE < 0.5%, TC = 110oC 250s PULSE TEST VGE = 15V VGE = 10V
CIES
1.0
0.5 COES CRES 0 5 10 15 20 25 VCE , COLLECTOR TO EMITTER VOLTAGE (V)
0
0
1.5 3.0 0.5 1.0 2.0 2.5 VCE , COLLECTOR TO EMITTER VOLTAGE (V)
3.5
FIGURE 15. CAPACITANCE vs COLLECTOR TO EMITTER VOLTAGE
FIGURE 16. COLLECTOR TO EMITTER ON-STATE VOLTAGE
ZJC , NORMALIZED THERMAL RESPONSE
100 0.50
0.20 0.10 10-1 0.05 0.02 0.01 SINGLE PULSE 10-2 -5 10 10-4 10-3 DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD X ZJC X RJC) + TC 10-2 PD t2 10-1 100 t1
t1 , RECTANGULAR PULSE DURATION (s)
FIGURE 17. NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE
Test Circuit and Waveforms
RHRD4120 90% VGE L = 5mH VCE RG = 25 + 90% ICE VDD = 960V 10% td(OFF)I tfI trI td(ON)I EOFF 10% EON2
-
FIGURE 18. INDUCTIVE SWITCHING TEST CIRCUIT
FIGURE 19. SWITCHING TEST WAVEFORMS
6
HGTP5N120CN, HGT1S5N120CNS Handling Precautions for IGBTs
Insulated Gate Bipolar Transistors are susceptible to gateinsulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler's body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as "ECCOSORBDTM LD26" or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate opencircuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection - These devices do not have an internal monolithic Zener diode from gate to emitter. If gate protection is required an external Zener is recommended.
Operating Frequency Information
Operating frequency information for a typical device (Figure 3) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 5, 6, 7, 8, 9 and 11. The operating frequency plot (Figure 3) of a typical device shows fMAX1 or fMAX2; whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. fMAX1 is defined by fMAX1 = 0.05/(td(OFF)I+ td(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on-state time for a 50% duty factor. Other definitions are possible. td(OFF)I and td(ON)I are defined in Figure 19. Device turn-off delay can establish an additional frequency limiting condition for an application other than TJM. td(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON2). The allowable dissipation (PD) is defined by PD = (TJM - TC)/RJC. The sum of device switching and conduction losses must not exceed PD. A 50% duty factor was used (Figure 3) and the conduction losses (PC) are approximated by PC = (VCE x ICE)/2. EON2 and EOFF are defined in the switching waveforms shown in Figure 19. EON2 is the integral of the instantaneous power loss (ICE x VCE) during turn-on and EOFF is the integral of the instantaneous power loss (ICE x VCE) during turn-off. All tail losses are included in the calculation for EOFF; i.e., the collector current equals zero (ICE = 0).
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com 7
ECCOSORBDTM is a trademark of Emerson and Cumming, Inc.

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