 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6724 Issued Date : 1993.01.13 Revised Date : 2002.01.17 Page No. : 1/3 HTIP32C PNP EPITAXIAL PLANAR TRANSISTOR Description The HTIP32C is designed for use in general purpose amplifier and switching applications. Absolute Maximum Ratings (Ta=25C) TO-220 * Maximum Temperatures Storage Temperature............................................................................................. -55 ~ +150 C Junction Temperature..................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 40 W Total Power Dissipation (Ta=25C) ....................................................................................... 2 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage.................................................................................... -100 V BVCEO Collector to Emitter Voltage................................................................................. -100 V BVEBO Emitter to Base Voltage........................................................................................... -5 V IC Collector Current.............................................................................................................. -3 A Characteristics (Ta=25C) Symbol BVCBO BVCEO ICES ICEO IEBO *VCE(sat) *VBE(on) *hFE1 *hFE2 fT Min. -100 -100 25 10 3 Typ. 45 Max. -200 -300 -1 -1.2 -1.8 50 Unit V V uA uA mA V V Test Conditions IC=-1mA, IE=0 IC=-30mA, IB=0 VCE=-100V VCE=-60V VEB=-5V IC=-3A, IB=-375mA IC=-3A, VCE=-4V IC=-1A, VCE=-4V IC=-3A, VCE=-4V IC=-0.5A, VCE=-10V, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz HTIP32C HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 100 1000 Spec. No. : HE6724 Issued Date : 1993.01.13 Revised Date : 2002.01.17 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 125 C o 75 C o hFE 25 C o 75 C 125 C 25 C VCE(sat) @ IC=8IB o o o hFE @ VCE=4V 10 1 10 100 1000 10000 100 1 10 100 1000 10000 Collector Current IC (mA) Collector Current IC (mA) ON Voltage & Collector Current 10000 10.00 Switching Time & Collector Current VCC=30V, IC=10IB1=-10IB2 Switching Times (us) ON Voltage (mV) 1.00 1000 25 C o Ton Tstg 0.10 Tf 125 C o 75 C o VBE(ON) @ VCE=4V 100 1 10 100 1000 10000 0.01 0.1 1.0 10.0 Collector Current IC (mA) Collector Current (A) Capacitance & Reverse-Biased Voltage 1000 100000 PT=1ms 10000 PT=100ms Safe Operating Area Collector Current-IC (mA) Capacitance (pF) PT=1s 1000 100 100 Cob 10 10 0.1 1 10 100 1 1 10 100 Reverse-Biased Voltage (V) Forward Voltage-VCE (V) HTIP32C HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-220AB Dimension Marking: A D B E C Date Code Spec. No. : HE6724 Issued Date : 1993.01.13 Revised Date : 2002.01.17 Page No. : 3/3 H TIP 32C Control Code H I G 4 P M 3 2 1 N K Style: Pin 1.Base 2.Collector 3.Emitter O 3-Lead TO-220AB Plastic Package HSMC Package Code: E *: Typical DIM A B C D E G H Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HTIP32C HSMC Product Specification |
Price & Availability of HTIP32C
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |